RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
6-30T-BD-24

6-30T-BD-24

COPPER BERYLLIUM FINGERSTOCK EMI

Leader Tech Inc.
2,883 -

RFQ

6-30T-BD-24

Ficha técnica

Bulk Twist Active Fingerstock - 0.300 (7.62mm) 24.000 (609.60mm) 0.070 (1.78mm) - - - -
0097011302

0097011302

CSTR,STR,BF .130X.890X.187X16

Laird Technologies EMI
3,528 -

RFQ

Bulk - Active Fingerstock - - - - - Unplated - -
0077010602

0077010602

FINGERSTOCK BECU 15.24X406.4MM

Laird Technologies EMI
2,993 -

RFQ

0077010602

Ficha técnica

Box Variable Slot Mount Active Fingerstock - 0.600 (15.24mm) 16.000 (406.40mm) 0.220 (5.59mm) Beryllium Copper - - Slot
4649PA51H01800

4649PA51H01800

GK,NICU,PTAFG,PU,V0,REC

Laird Technologies EMI
2,378 -

RFQ

4649PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.276 (7.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0078001402

0078001402

NOSG,STR,BF,USF,PSA

Laird Technologies EMI
2,913 -

RFQ

0078001402

Ficha técnica

Bulk Ultrasoft No Snag Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.220 (5.59mm) Beryllium Copper - - Slot
3-23UT-040-DL-BD-16

3-23UT-040-DL-BD-16

0.03 X 0.15 X 040 BD 16--TWIST C

Leader Tech Inc.
3,431 -

RFQ

3-23UT-040-DL-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.230 (5.84mm) 16.000 (406.40mm) 0.030 (0.76mm) Beryllium Copper Unplated - Adhesive
11-S-32AF-SN-6.90

11-S-32AF-SN-6.90

0.11 X 0.32 SN 6.90--11-S-32AF-S

Leader Tech Inc.
2,417 -

RFQ

11-S-32AF-SN-6.90

Ficha técnica

Bulk - Active Fingerstock - 0.320 (8.13mm) 6.900 (175.26mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
11-S-32AF-SN-7.64

11-S-32AF-SN-7.64

0.11 X 0.32 SN 7.64--11-S-32AF-S

Leader Tech Inc.
3,792 -

RFQ

11-S-32AF-SN-7.64

Ficha técnica

Bulk - Active Fingerstock - 0.320 (8.13mm) 7.640 (194.06mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
0077001219

0077001219

NOSG, STR,NIB,PSA

Laird Technologies EMI
3,708 -

RFQ

0077001219

Ficha técnica

Bulk No Snag Active Fingerstock - 0.320 (8.13mm) 24.000 (609.60mm) 0.110 (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
7300-0055-72

7300-0055-72

KNITTED WIRE-DOUBLE ROUND--7300-

Leader Tech Inc.
3,165 -

RFQ

7300-0055-72

Ficha técnica

Bulk - Active Gasket Round 0.750 (19.05mm) - - - Tin - -
8101-0104-40

8101-0104-40

UFR,BECU,BF,RL 4.0MM

Laird Technologies EMI
2,702 -

RFQ

Bulk Ultraflex Active Gasket Round 0.117 (2.97mm) - 0.150 (3.80mm) Beryllium Copper Unplated - -
4649PA51G01800

4649PA51G01800

GK,NICU,NRSG,PU,V0,REC

Laird Technologies EMI
2,014 -

RFQ

4649PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.276 (7.00mm) - - - Adhesive
4053PA51H04800

4053PA51H04800

GK NICU PTAFG PU V0 DSH

Laird Technologies EMI
3,963 -

RFQ

4053PA51H04800

Ficha técnica

Bulk 51H Active Fabric Over Foam D-Shape 0.091 (2.30mm) 48.000 (121.90cm) 0.091 (2.30mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0098061902

0098061902

CLO,STR,BF,USFT

Laird Technologies EMI
3,773 -

RFQ

0098061902

Ficha técnica

Bulk Ultrasoft Clip-On Active Fingerstock - 0.440 (11.18mm) 16.000 (406.40mm) 0.080 (2.03mm) Beryllium Copper - - Clip
4184PA51H04800

4184PA51H04800

GK NICU PTAFG PU V0 DSH

Laird Technologies EMI
2,976 -

RFQ

4184PA51H04800

Ficha técnica

Bulk 51H Active Fabric Over Foam D-Shape 0.150 (3.80mm) 48.000 (121.92cm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0C97055517

0C97055517

TWT COIL SNB PSA

Laird Technologies EMI
3,562 -

RFQ

Bulk Twist Active Fingerstock - 0.340 (8.64mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097097617

0097097617

LS,STR,SNB,CLO

Laird Technologies EMI
2,880 -

RFQ

0097097617

Ficha técnica

Bulk Clip-On Longitudinal Grounding Active Fingerstock - 0.295 (7.49mm) 17.000 (433.22mm) 0.176 (4.47mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
0078004302

0078004302

NOSG,STR,BF,USF,PSA

Laird Technologies EMI
3,717 -

RFQ

0078004302

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.450 (11.43mm) 0.262 (6.67mm) 0.080 (2.03mm) Beryllium Copper - - Adhesive
0078007102

0078007102

NOSG,STR,BF,USFT,PSA

Laird Technologies EMI
3,943 -

RFQ

0078007102

Ficha técnica

Bulk Ultrasoft Hook-on Active Fingerstock - 0.450 (11.43mm) 16.200 (411.48mm) 0.122 (3.10mm) Beryllium Copper - - Slot
46X2D09520.NN00

46X2D09520.NN00

HFR,NICU,PTAF,CPSA,SL 95MMX20M

Laird Technologies EMI
2,562 -

RFQ

Bulk - Active - - - - - - - - -
Total 4831 Record«Prev1... 7576777879808182...242Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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