Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-87-318-41-036101

146-87-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,877 -

RFQ

146-87-318-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-005101

110-83-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,990 -

RFQ

110-83-624-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-605101

110-83-624-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,319 -

RFQ

110-83-624-41-605101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-003101

116-87-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,623 -

RFQ

116-87-422-41-003101

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-32/Z-T

AW 127-32/Z-T

SOCKET 32 CONTACTS SINGLE ROW

Assmann WSW Components
3,160 -

RFQ

AW 127-32/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
110-87-632-41-001151

110-87-632-41-001151

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,932 -

RFQ

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-052-09-041101

510-87-052-09-041101

CONN SOCKET PGA 52POS GOLD

Preci-Dip
2,178 -

RFQ

510-87-052-09-041101

Ficha técnica

Bulk 510 Active PGA 52 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-007101

116-87-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,092 -

RFQ

116-87-318-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-006101

116-87-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,930 -

RFQ

116-87-422-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-636-41-001101

115-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,370 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-044-24-008

540-88-044-24-008

CONN SOCKET PLCC 44POS TIN

Preci-Dip
2,063 -

RFQ

540-88-044-24-008

Ficha técnica

Bulk 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
146-83-314-41-036101

146-83-314-41-036101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,205 -

RFQ

146-83-314-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-007101

116-83-314-41-007101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,835 -

RFQ

116-83-314-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-328-41-001101

614-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,561 -

RFQ

614-87-328-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-318-31-012101

614-83-318-31-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,299 -

RFQ

614-83-318-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-624-41-001101

115-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,812 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-009101

116-87-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,165 -

RFQ

116-87-316-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-324-41-117101

114-83-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,387 -

RFQ

114-83-324-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-324-41-134161

114-83-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,439 -

RFQ

114-83-324-41-134161

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-107-41-013000

346-93-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.
3,575 -

RFQ

346-93-107-41-013000

Ficha técnica

Bulk 346 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 101102103104105106107108...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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