Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR24-HZL-TT

AR24-HZL-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components
2,565 -

RFQ

AR24-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR28-HZL-TT

AR28-HZL-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components
2,426 -

RFQ

AR28-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
A06-LCG-T

A06-LCG-T

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components
2,785 -

RFQ

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold - - Through Hole Open Frame Solder 0.100 (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled
A08-LCG

A08-LCG

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components
2,461 -

RFQ

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A14-LCG

A14-LCG

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components
3,953 -

RFQ

A14-LCG

Ficha técnica

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A16-LCG

A16-LCG

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
2,379 -

RFQ

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A18-LCG

A18-LCG

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
2,037 -

RFQ

A18-LCG

Ficha técnica

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A20-LCG

A20-LCG

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
3,046 -

RFQ

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A22-LCG

A22-LCG

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components
3,122 -

RFQ

A22-LCG

Ficha técnica

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A24-LCG

A24-LCG

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
2,470 -

RFQ

- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A28-LCG

A28-LCG

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
2,986 -

RFQ

- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components
3,519 -

RFQ

- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
AR22-HZW/T

AR22-HZW/T

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components
2,638 -

RFQ

AR22-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZW/T

AR24-HZW/T

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
2,632 -

RFQ

AR24-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR28-HZW/T

AR28-HZW/T

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
3,245 -

RFQ

AR28-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR40-HZW/T

AR40-HZW/T

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components
2,330 -

RFQ

AR40-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR08-HZL-TT

AR08-HZL-TT

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components
3,915 -

RFQ

AR08-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR14-HZL-TT

AR14-HZL-TT

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components
2,584 -

RFQ

AR14-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR16-HZL-TT

AR16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components
3,176 -

RFQ

AR16-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR18-HZL-TT

AR18-HZL-TT

CONN IC DIP SOCKET 18POS TIN

Assmann WSW Components
2,128 -

RFQ

AR18-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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