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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-83-040-11-061101CONN SOCKET PGA 40POS GOLD Preci-Dip |
2,596 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 40 (11 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-318-41-008101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
2,463 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
04-3513-11CONN IC DIP SOCKET 4POS GOLD Aries Electronics |
2,525 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-0513-11HCONN SOCKET SIP 6POS GOLD Aries Electronics |
3,238 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0513-11CONN SOCKET SIP 7POS GOLD Aries Electronics |
2,614 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0518-11CONN SOCKET SIP 11POS GOLD Aries Electronics |
3,355 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-0508-21CONN SOCKET SIP 2POS GOLD Aries Electronics |
2,936 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
02-0508-31CONN SOCKET SIP 2POS GOLD Aries Electronics |
2,612 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
02-1508-21CONN IC DIP SOCKET 2POS GOLD Aries Electronics |
2,255 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
02-1508-31CONN IC DIP SOCKET 2POS GOLD Aries Electronics |
3,438 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
06-3513-11CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
2,424 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3518-10TCONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,807 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-87-322-41-009101CONN IC DIP SOCKET 22POS GOLD Preci-Dip |
3,761 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-422-41-009101CONN IC DIP SOCKET 22POS GOLD Preci-Dip |
3,385 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-318-41-011101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
3,643 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-068-11-001101CONN SOCKET PGA 68POS GOLD Preci-Dip |
2,058 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-068-11-061101CONN SOCKET PGA 68POS GOLD Preci-Dip |
3,361 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-068-11-062101CONN SOCKET PGA 68POS GOLD Preci-Dip |
2,632 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-068-10-001101CONN SOCKET PGA 68POS GOLD Preci-Dip |
3,076 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-068-10-061101CONN SOCKET PGA 68POS GOLD Preci-Dip |
3,484 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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