Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-632-41-006101

116-87-632-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,962 -

RFQ

116-87-632-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-069-11-001101

510-87-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip
3,964 -

RFQ

510-87-069-11-001101

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-069-11-061101

510-87-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip
2,934 -

RFQ

510-87-069-11-061101

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-324-41-035101

146-87-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,151 -

RFQ

146-87-324-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-648-41-005101

117-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,458 -

RFQ

117-87-648-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-632-41-003101

115-83-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,837 -

RFQ

115-83-632-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-312-10-001101

299-87-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,813 -

RFQ

299-87-312-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-628-41-001101

614-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,011 -

RFQ

614-83-628-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-072-11-001101

510-87-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,204 -

RFQ

510-87-072-11-001101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-072-11-041101

510-87-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,877 -

RFQ

510-87-072-11-041101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-072-11-061101

510-87-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
3,775 -

RFQ

510-87-072-11-061101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-012101

116-87-320-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,757 -

RFQ

116-87-320-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-310-10-001101

299-83-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,088 -

RFQ

299-83-310-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-424-41-001101

612-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,172 -

RFQ

612-83-424-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-040-11-061101

510-83-040-11-061101

CONN SOCKET PGA 40POS GOLD

Preci-Dip
2,596 -

RFQ

510-83-040-11-061101

Ficha técnica

Bulk 510 Active PGA 40 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-008101

116-83-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,463 -

RFQ

116-83-318-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-009101

116-87-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,761 -

RFQ

116-87-322-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-009101

116-87-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,385 -

RFQ

116-87-422-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-011101

116-87-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,643 -

RFQ

116-87-318-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-001101

510-87-068-11-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,058 -

RFQ

510-87-068-11-001101

Ficha técnica

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4748495051525354...142Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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