Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-650-41-012101

116-83-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,788 -

RFQ

116-83-650-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-009101

116-87-648-41-009101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,673 -

RFQ

116-87-648-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-177-15-061101

510-87-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip
3,266 -

RFQ

510-87-177-15-061101

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-650-41-001101

122-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,121 -

RFQ

122-83-650-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-650-41-001101

123-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,804 -

RFQ

123-83-650-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-652-41-001101

122-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,659 -

RFQ

122-87-652-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-652-41-001101

123-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,883 -

RFQ

123-87-652-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-044-08-031112

614-83-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip
2,115 -

RFQ

614-83-044-08-031112

Ficha técnica

Bulk 614 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-15-041101

510-87-179-15-041101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,291 -

RFQ

510-87-179-15-041101

Ficha técnica

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-001101

510-87-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
3,110 -

RFQ

510-87-179-18-001101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-112101

510-87-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,676 -

RFQ

510-87-179-18-112101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-113101

510-87-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,048 -

RFQ

510-87-179-18-113101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-652-41-001101

121-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,215 -

RFQ

121-83-652-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-007101

116-87-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,998 -

RFQ

116-87-650-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-111101

510-87-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
3,203 -

RFQ

510-87-179-18-111101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-17-081101

510-87-180-17-081101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,504 -

RFQ

510-87-180-17-081101

Ficha técnica

Bulk 510 Active PGA 180 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-18-111101

510-87-180-18-111101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,453 -

RFQ

510-87-180-18-111101

Ficha técnica

Bulk 510 Active PGA 180 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-001101

510-87-180-15-001101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,752 -

RFQ

510-87-180-15-001101

Ficha técnica

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-041101

510-87-180-15-041101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,402 -

RFQ

510-87-180-15-041101

Ficha técnica

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-656-41-105101

117-83-656-41-105101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip
3,755 -

RFQ

117-83-656-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 93949596979899100...142Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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