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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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26-1518-11HCONN IC DIP SOCKET 26POS GOLD Aries Electronics |
2,988 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-83-148-15-061101CONN SOCKET PGA 148POS GOLD Preci-Dip |
2,834 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 148 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-148-15-062101CONN SOCKET PGA 148POS GOLD Preci-Dip |
3,208 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 148 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
16-823-90TCONN IC DIP SOCKET 16POS TIN Aries Electronics |
3,539 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
510-83-169-13-000101CONN SOCKET PGA 169POS GOLD Preci-Dip |
2,071 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-068-11-061135CONN SOCKET PGA 68POS GOLD Preci-Dip |
3,736 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 68 (11 x 11) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-068-11-061136CONN SOCKET PGA 68POS GOLD Preci-Dip |
2,466 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 68 (11 x 11) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-149-15-003101CONN SOCKET PGA 149POS GOLD Preci-Dip |
3,124 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
32-1518-00CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,222 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
19-0511-10CONN SOCKET SIP 19POS TIN Aries Electronics |
3,739 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-3513-11HCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,029 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-6823-90TCONN IC DIP SOCKET 14POS TIN Aries Electronics |
2,929 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
612-91-304-41-003000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
2,558 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
20-3518-11HCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,001 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3503-21CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,333 | - |
RFQ |
Ficha técnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3503-31CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,660 | - |
RFQ |
Ficha técnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
123-47-304-41-001000STANDARD WIRE WRAP DBL SKT Mill-Max Manufacturing Corp. |
3,301 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-169-17-101101CONN SOCKET PGA 169POS GOLD Preci-Dip |
3,525 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-159-16-071101CONN SOCKET PGA 159POS GOLD Preci-Dip |
3,723 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 159 (16 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
48-6513-11CONN IC DIP SOCKET 48POS GOLD Aries Electronics |
2,038 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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