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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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06-3508-31CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
3,686 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-6823-90TCONN IC DIP SOCKET 20POS TIN Aries Electronics |
2,951 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
08-6823-90CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,696 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
10-81250-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,627 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8335-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,048 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8340-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,358 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8433-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,648 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8440-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,164 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8470-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,877 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8545-610CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,893 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-83-640-41-004101CONN IC DIP SOCKET 40POS GOLD Preci-Dip |
2,832 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
APA-628-T-CADAPTER PLUG Samtec Inc. |
2,483 | - |
RFQ |
Bulk | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
122-13-304-41-001000CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp. |
3,920 | - |
RFQ |
Ficha técnica |
Tube | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-179-18-001101CONN SOCKET PGA 179POS GOLD Preci-Dip |
2,149 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 179 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
510-83-179-18-111101CONN SOCKET PGA 179POS GOLD Preci-Dip |
2,986 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 179 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-179-18-112101CONN SOCKET PGA 179POS GOLD Preci-Dip |
2,482 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 179 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-179-18-113101CONN SOCKET PGA 179POS GOLD Preci-Dip |
3,453 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 179 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
ICF-324-S-O.100 SURFACE MOUNT SCREW MACHIN Samtec Inc. |
3,819 | - |
RFQ |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|
|
03-71250-10CONN SOCKET SIP 3POS TIN Aries Electronics |
2,736 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
03-7360-10CONN SOCKET SIP 3POS TIN Aries Electronics |
2,225 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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