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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-6503-30CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,143 | - |
RFQ |
Ficha técnica |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
21-0503-20CONN SOCKET SIP 21POS GOLD Aries Electronics |
2,994 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
21-0503-30CONN SOCKET SIP 21POS GOLD Aries Electronics |
2,541 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
32-C212-10HCONN IC DIP SOCKET 32POS GOLD Aries Electronics |
3,723 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-0501-21CONN SOCKET SIP 10POS GOLD Aries Electronics |
2,993 | - |
RFQ |
Ficha técnica |
Bulk | 501 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
546-87-121-13-061135CONN SOCKET PGA 121POS GOLD Preci-Dip |
3,796 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 121 (13 x 13) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-121-13-061136CONN SOCKET PGA 121POS GOLD Preci-Dip |
2,000 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 121 (13 x 13) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-642-41-013101CONN IC DIP SOCKET 42POS GOLD Preci-Dip |
2,614 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-223-18-002101CONN SOCKET PGA 223POS GOLD Preci-Dip |
3,070 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-223-18-091101CONN SOCKET PGA 223POS GOLD Preci-Dip |
3,508 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-223-18-092101CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,328 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-223-18-093101CONN SOCKET PGA 223POS GOLD Preci-Dip |
3,117 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-223-18-094101CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,599 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-084-10-031112CONN SOCKET PGA 84POS GOLD Preci-Dip |
3,647 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 84 (10 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-084-10-001112CONN SOCKET PGA 84POS GOLD Preci-Dip |
2,435 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 84 (10 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-224-18-091101CONN SOCKET PGA 224POS GOLD Preci-Dip |
3,235 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 224 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
30-6513-11HCONN IC DIP SOCKET 30POS GOLD Aries Electronics |
2,870 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-6810-90CONN IC DIP SOCKET 12POS GOLD Aries Electronics |
2,647 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
09-71000-10CONN SOCKET SIP 9POS TIN Aries Electronics |
2,625 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
09-7325-10CONN SOCKET SIP 9POS TIN Aries Electronics |
3,182 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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