Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
104-13-310-41-780000

104-13-310-41-780000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,206 -

RFQ

104-13-310-41-780000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
510-83-236-17-061101

510-83-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
2,737 -

RFQ

510-83-236-17-061101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-236-17-062101

510-83-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
2,067 -

RFQ

510-83-236-17-062101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-084-10-031101

550-10-084-10-031101

PGA SOLDER TAIL

Preci-Dip
2,124 -

RFQ

550-10-084-10-031101

Ficha técnica

Bulk 550 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-99-308-41-001000

210-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.
2,418 -

RFQ

210-99-308-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-308-41-001000

210-44-308-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,721 -

RFQ

210-44-308-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-628-T-B

APA-628-T-B

ADAPTER PLUG

Samtec Inc.
3,349 -

RFQ

Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
605-93-310-11-480000

605-93-310-11-480000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.
3,584 -

RFQ

605-93-310-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-310-11-480000

605-43-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,873 -

RFQ

605-43-310-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-310-41-001000

110-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,612 -

RFQ

110-93-310-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-310-41-001000

110-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,441 -

RFQ

110-43-310-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-304-61-105000

110-43-304-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,370 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-304-61-105000

110-93-304-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,526 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-83-237-17-061101

510-83-237-17-061101

CONN SOCKET PGA 237POS GOLD

Preci-Dip
2,521 -

RFQ

510-83-237-17-061101

Ficha técnica

Bulk 510 Active PGA 237 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-44-306-01-670800

214-44-306-01-670800

IC SOCKET 6PIN CLOSED FRAME SMD

Mill-Max Manufacturing Corp.
3,027 -

RFQ

214-44-306-01-670800

Ficha técnica

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-306-01-670800

214-99-306-01-670800

214 DIP DUAL IN LINE SOCKET

Mill-Max Manufacturing Corp.
3,573 -

RFQ

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICO-640-ZLGT

ICO-640-ZLGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.
2,782 -

RFQ

ICO-640-ZLGT

Ficha técnica

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
123-91-210-41-001000

123-91-210-41-001000

SOCKET IC OPEN 3 LVL .200 10POS

Mill-Max Manufacturing Corp.
3,190 -

RFQ

Tube 123 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-210-41-001000

123-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,605 -

RFQ

123-41-210-41-001000

Ficha técnica

Tube 123 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-306-41-001000

210-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,456 -

RFQ

210-41-306-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 295296297298299300301302...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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