Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-210-41-001000

126-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,709 -

RFQ

126-41-210-41-001000

Ficha técnica

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-210-41-001000

126-91-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,425 -

RFQ

126-91-210-41-001000

Ficha técnica

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-310-41-006000

116-41-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,000 -

RFQ

116-41-310-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-310-41-006000

116-91-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,724 -

RFQ

116-91-310-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-308-41-117000

114-41-308-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,621 -

RFQ

114-41-308-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-308-41-117000

114-91-308-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,933 -

RFQ

114-91-308-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-310-41-003000

612-43-310-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,801 -

RFQ

612-43-310-41-003000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-310-41-003000

612-93-310-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,207 -

RFQ

612-93-310-41-003000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-0511-11

12-0511-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics
3,629 -

RFQ

12-0511-11

Ficha técnica

Bulk 511 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3551-10

24-3551-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,527 -

RFQ

24-3551-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3552-10

24-3552-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,749 -

RFQ

24-3552-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3553-10

24-3553-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,162 -

RFQ

24-3553-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6551-10

24-6551-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,566 -

RFQ

24-6551-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6552-10

24-6552-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,340 -

RFQ

24-6552-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6553-10

24-6553-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,004 -

RFQ

24-6553-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
317-47-105-41-005000

317-47-105-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
3,001 -

RFQ

317-47-105-41-005000

Ficha técnica

Bulk 317 Active SIP 5 (1 x 5) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-310-41-002000

126-93-310-41-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,993 -

RFQ

126-93-310-41-002000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-310-41-002000

126-43-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,963 -

RFQ

126-43-310-41-002000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-144-13-041135

546-87-144-13-041135

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,834 -

RFQ

546-87-144-13-041135

Ficha técnica

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-144-13-041136

546-87-144-13-041136

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,283 -

RFQ

546-87-144-13-041136

Ficha técnica

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 303304305306307308309310...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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