Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-314-41-605000

110-91-314-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,062 -

RFQ

110-91-314-41-605000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-107-41-005000

317-93-107-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,560 -

RFQ

317-93-107-41-005000

Ficha técnica

Bulk 317 Active SIP 7 (1 x 7) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-306-41-007000

116-93-306-41-007000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
3,611 -

RFQ

116-93-306-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-41-007000

116-43-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,377 -

RFQ

116-43-306-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-318-41-001000

210-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,050 -

RFQ

210-41-318-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-318-41-001000

210-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,118 -

RFQ

210-91-318-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-007000

614-41-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,442 -

RFQ

614-41-306-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-31-007000

614-91-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,854 -

RFQ

614-91-306-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-61-008000

116-43-304-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,944 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-304-61-008000

116-93-304-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,161 -

RFQ

Tube * Active - - - - - - - - - - - - - -
APA-324-G-A1

APA-324-G-A1

ADAPTER PLUG

Samtec Inc.
3,970 -

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-A1

APA-624-G-A1

ADAPTER PLUG

Samtec Inc.
2,369 -

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-93-314-10-002000

110-93-314-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,934 -

RFQ

110-93-314-10-002000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-41-001000

614-41-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,562 -

RFQ

614-41-306-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-41-001000

614-91-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,008 -

RFQ

614-91-306-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-324-41-001000

210-47-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,356 -

RFQ

210-47-324-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-624-41-001000

210-47-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,756 -

RFQ

210-47-624-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-424-41-001000

210-47-424-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,710 -

RFQ

210-47-424-41-001000

Ficha técnica

Tube 210 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-320-41-003000

115-44-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,284 -

RFQ

115-44-320-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
37-PGM10012-10

37-PGM10012-10

CONN SOCKET PGA GOLD

Aries Electronics
3,289 -

RFQ

37-PGM10012-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 319320321322323324325326...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário