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Soquetes para CIs, Transistores

Número da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
210-11-318-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,343	-	RFQ	Ficha técnica	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-114-41-005000 STANDRD SOLDRTL SNG SKT Mill-Max Manufacturing Corp.	2,973	-	RFQ	Ficha técnica	Bulk	317	Active	SIP	14 (1 x 14)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-7350-10 CONN SOCKET SIP 14POS TIN Aries Electronics	3,836	-	RFQ	Ficha técnica	Bulk	700 Elevator Strip-Line™	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-7380-10 CONN SOCKET SIP 14POS TIN Aries Electronics	2,260	-	RFQ	Ficha técnica	Bulk	700 Elevator Strip-Line™	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-7470-10 CONN SOCKET SIP 14POS TIN Aries Electronics	3,791	-	RFQ	Ficha técnica	Bulk	700 Elevator Strip-Line™	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-7500-10 CONN SOCKET SIP 14POS TIN Aries Electronics	2,178	-	RFQ	Ficha técnica	Bulk	700 Elevator Strip-Line™	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-7750-10 CONN SOCKET SIP 14POS TIN Aries Electronics	3,517	-	RFQ	Ficha técnica	Bulk	700 Elevator Strip-Line™	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
24-820-90C CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3,049	-	RFQ	Ficha técnica	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-822-90C CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,695	-	RFQ	Ficha técnica	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-823-90C CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,329	-	RFQ	Ficha técnica	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
317-91-110-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	3,560	-	RFQ	Ficha técnica	Bulk	317	Active	SIP	10 (1 x 10)	0.070 (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	2,814	-	RFQ	Ficha técnica	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-318-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,390	-	RFQ	Ficha técnica	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-108-41-005000 CONN SKT TRANSISTOR Mill-Max Manufacturing Corp.	2,508	-	RFQ	Ficha técnica	Tube	917	Active	Transistor, TO-5	8 (Round)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-208-41-005000 CONN SKT TRANSISTOR Mill-Max Manufacturing Corp.	2,371	-	RFQ	Ficha técnica	Tube	917	Active	Transistor, TO-100	8 (Round)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-91-108-41-005000 CONN SKT TRANSISTOR Mill-Max Manufacturing Corp.	2,329	-	RFQ	Ficha técnica	Tube	917	Active	Transistor, TO-5	8 (Round)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-91-208-41-005000 CONN SKT TRANSISTOR Mill-Max Manufacturing Corp.	2,532	-	RFQ	Ficha técnica	Tube	917	Active	Transistor, TO-100	8 (Round)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-632-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	3,675	-	RFQ	Ficha técnica	Tube	210	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-632-41-003000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	2,777	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8080-1G31 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	2,860	-	RFQ	Ficha técnica	Bulk	8060	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)