Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-322-41-105000

110-41-322-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,442 -

RFQ

110-41-322-41-105000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-422-41-105000

110-41-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,691 -

RFQ

110-41-422-41-105000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-322-41-105000

110-91-322-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,129 -

RFQ

110-91-322-41-105000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-422-41-105000

110-91-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,570 -

RFQ

110-91-422-41-105000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4518-10E

22-4518-10E

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,464 -

RFQ

22-4518-10E

Ficha técnica

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-43-328-10-002000

110-43-328-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,612 -

RFQ

110-43-328-10-002000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-636-41-001000

210-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,665 -

RFQ

210-41-636-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-636-41-001000

210-91-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,492 -

RFQ

210-91-636-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-308-41-001000

612-11-308-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,464 -

RFQ

612-11-308-41-001000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-318-41-117000

114-93-318-41-117000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
3,845 -

RFQ

114-93-318-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-318-41-117000

114-43-318-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,833 -

RFQ

114-43-318-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-322-41-001000

110-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,630 -

RFQ

110-11-322-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-422-41-001000

110-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,651 -

RFQ

110-11-422-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-324-41-605000

110-47-324-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,366 -

RFQ

110-47-324-41-605000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-624-41-605000

110-47-624-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,878 -

RFQ

110-47-624-41-605000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-322-41-117000

114-47-322-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,290 -

RFQ

114-47-322-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-422-41-117000

114-47-422-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,818 -

RFQ

114-47-422-41-117000

Ficha técnica

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-306-41-001000

123-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
2,218 -

RFQ

123-93-306-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-306-41-001000

123-43-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,637 -

RFQ

123-43-306-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-0501-21

16-0501-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics
3,532 -

RFQ

16-0501-21

Ficha técnica

Bulk 501 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 344345346347348349350351...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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