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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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84-PRS10003-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,437 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS11032-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,727 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS12022-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,325 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS13053-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,445 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS13125-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,250 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
18-PRS17041-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,532 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
56-PRS15057-12ZIF PGA SOCKET 56PIN 15X15 Aries Electronics |
3,488 | - |
RFQ |
- | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | |
|
|
56-PLS14031-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,845 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
56-PLS15057-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,763 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
56-PRS14031-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,278 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
44-6552-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,103 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3554-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,682 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-6553-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,098 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3551-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,446 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3552-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,933 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3553-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,330 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-6551-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,848 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-6554-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,252 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
85-PRS11008-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,718 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
101-PRS13022-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,001 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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