Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-1518-11H

20-1518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,282 -

RFQ

20-1518-11H

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0518-11

34-0518-11

CONN SOCKET SIP 34POS GOLD

Aries Electronics
3,466 -

RFQ

34-0518-11

Ficha técnica

Bulk 518 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0511-10

03-0511-10

CONN SOCKET SIP 3POS TIN

Aries Electronics
2,671 -

RFQ

03-0511-10

Ficha técnica

Bulk 511 Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-0511-11

04-0511-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,387 -

RFQ

04-0511-11

Ficha técnica

Bulk 511 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-11

22-4513-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,094 -

RFQ

22-4513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3513-10H

20-3513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,308 -

RFQ

20-3513-10H

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10M

24-3518-10M

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,261 -

RFQ

24-3518-10M

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6513-11H

14-6513-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,430 -

RFQ

14-6513-11H

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-00

24-0518-00

CONN SOCKET SIP 24POS GOLD

Aries Electronics
3,810 -

RFQ

24-0518-00

Ficha técnica

Bulk 518 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-00

24-1518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,761 -

RFQ

24-1518-00

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-111

16-3518-111

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,375 -

RFQ

16-3518-111

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-101H

20-3518-101H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,592 -

RFQ

20-3518-101H

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-101

24-3518-101

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,833 -

RFQ

24-3518-101

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C195-11

14-C195-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,197 -

RFQ

14-C195-11

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-11

14-C280-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,111 -

RFQ

14-C280-11

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81000-310C

06-81000-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,964 -

RFQ

06-81000-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81140-310C

06-81140-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,488 -

RFQ

06-81140-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81250-310C

06-81250-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,548 -

RFQ

06-81250-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8285-310C

06-8285-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,275 -

RFQ

06-8285-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8300-310C

06-8300-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,732 -

RFQ

06-8300-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 4344454647484950...217Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário