Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-422-31-018000

614-41-422-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,704 -

RFQ

614-41-422-31-018000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-322-31-018000

614-91-322-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,560 -

RFQ

614-91-322-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-422-31-018000

614-91-422-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,690 -

RFQ

614-91-422-31-018000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-316-41-001000

121-11-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,766 -

RFQ

121-11-316-41-001000

Ficha técnica

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-119-41-005000

317-93-119-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,762 -

RFQ

317-93-119-41-005000

Ficha técnica

Bulk 317 Active SIP 19 (1 x 19) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-320-31-007000

614-93-320-31-007000

SOCKET CARRIER LOWPRO .300 20POS

Mill-Max Manufacturing Corp.
3,514 -

RFQ

614-93-320-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-420-31-007000

614-93-420-31-007000

SOCKET CARRIER LOWPRO .400 20POS

Mill-Max Manufacturing Corp.
3,281 -

RFQ

614-93-420-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-320-31-007000

614-43-320-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,865 -

RFQ

614-43-320-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-420-31-007000

614-43-420-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,481 -

RFQ

614-43-420-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-322-41-003000

116-93-322-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,810 -

RFQ

116-93-322-41-003000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-422-41-003000

116-93-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,607 -

RFQ

116-93-422-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-99-132-41-013000

346-99-132-41-013000

CONN SOCKET SIP 32POS TIN-LEAD

Mill-Max Manufacturing Corp.
3,607 -

RFQ

346-99-132-41-013000

Ficha técnica

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-322-41-003000

116-43-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,211 -

RFQ

116-43-322-41-003000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-422-41-003000

116-43-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,236 -

RFQ

116-43-422-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-157-31-018000

714-43-157-31-018000

CONN SOCKET SIP 57POS GOLD

Mill-Max Manufacturing Corp.
2,545 -

RFQ

714-43-157-31-018000

Ficha técnica

Bulk 714 Active SIP 57 (1 x 57) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-632-41-605000

110-93-632-41-605000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,016 -

RFQ

110-93-632-41-605000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-632-41-605000

110-43-632-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,447 -

RFQ

110-43-632-41-605000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-516-11S

28-516-11S

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics
2,187 -

RFQ

28-516-11S

Ficha técnica

Bulk 516 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
116-41-324-41-007000

116-41-324-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,593 -

RFQ

116-41-324-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-424-41-007000

116-41-424-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,405 -

RFQ

116-41-424-41-007000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 396397398399400401402403...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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