Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-93-322-41-003000

126-93-322-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,966 -

RFQ

126-93-322-41-003000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-422-41-003000

126-93-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,680 -

RFQ

126-93-422-41-003000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-322-41-003000

126-43-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,504 -

RFQ

126-43-322-41-003000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-422-41-003000

126-43-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,478 -

RFQ

126-43-422-41-003000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-950-41-001000

110-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,877 -

RFQ

110-11-950-41-001000

Ficha técnica

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-430-41-002000

127-93-430-41-002000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.
3,952 -

RFQ

127-93-430-41-002000

Ficha técnica

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-430-41-002000

127-43-430-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,131 -

RFQ

127-43-430-41-002000

Ficha técnica

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-636-41-117000

114-93-636-41-117000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
3,798 -

RFQ

114-93-636-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-636-41-117000

114-43-636-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,596 -

RFQ

114-43-636-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-650-41-117000

114-41-650-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,588 -

RFQ

114-41-650-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-650-41-117000

114-91-650-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,152 -

RFQ

114-91-650-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-324-31-007000

614-93-324-31-007000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.
2,997 -

RFQ

614-93-324-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-424-31-007000

614-93-424-31-007000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.
2,527 -

RFQ

614-93-424-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-624-31-007000

614-93-624-31-007000

SOCKET CARRIER LOWPRO .600 24POS

Mill-Max Manufacturing Corp.
3,646 -

RFQ

614-93-624-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-324-31-007000

614-43-324-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,646 -

RFQ

614-43-324-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-424-31-007000

614-43-424-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,293 -

RFQ

614-43-424-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-007000

614-43-624-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,527 -

RFQ

614-43-624-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-432-31-002000

614-43-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,756 -

RFQ

614-43-432-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-632-31-002000

614-43-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,198 -

RFQ

614-43-632-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-432-31-002000

614-93-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,721 -

RFQ

614-93-432-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 433434435436437438439440...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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