Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-41-432-41-003000

612-41-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,821 -

RFQ

612-41-432-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-632-41-003000

612-41-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,399 -

RFQ

612-41-632-41-003000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-432-41-003000

612-91-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,535 -

RFQ

612-91-432-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-632-41-003000

612-91-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,477 -

RFQ

612-91-632-41-003000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-432-41-001000

614-93-432-41-001000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.
3,778 -

RFQ

614-93-432-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-41-001000

614-93-632-41-001000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.
3,461 -

RFQ

614-93-632-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-432-41-003000

116-41-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,972 -

RFQ

116-41-432-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-632-41-003000

116-41-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,476 -

RFQ

116-41-632-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-432-41-003000

116-91-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,464 -

RFQ

116-91-432-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-632-41-003000

116-91-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,890 -

RFQ

116-91-632-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-432-41-001000

614-43-432-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,061 -

RFQ

614-43-432-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-632-41-001000

614-43-632-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,633 -

RFQ

614-43-632-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-31-012000

614-41-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,984 -

RFQ

614-41-642-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-31-012000

614-91-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,019 -

RFQ

614-91-642-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-952-41-006000

116-47-952-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,143 -

RFQ

116-47-952-41-006000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-6810-90T

20-6810-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics
2,660 -

RFQ

20-6810-90T

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
117-41-316-41-105000

117-41-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,869 -

RFQ

117-41-316-41-105000

Ficha técnica

Tube 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-964-41-117000

114-47-964-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,367 -

RFQ

114-47-964-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-650-41-105000

110-47-650-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,227 -

RFQ

110-47-650-41-105000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-950-41-105000

110-47-950-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,035 -

RFQ

110-47-950-41-105000

Ficha técnica

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 440441442443444445446447...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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