Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-93-324-41-001000

614-93-324-41-001000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.
3,110 -

RFQ

614-93-324-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-424-41-001000

614-93-424-41-001000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.
3,934 -

RFQ

614-93-424-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-624-41-001000

614-93-624-41-001000

SOCKET CARRIER LOWPRO .600 24POS

Mill-Max Manufacturing Corp.
2,340 -

RFQ

614-93-624-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-324-41-001000

614-43-324-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,899 -

RFQ

614-43-324-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-424-41-001000

614-43-424-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,473 -

RFQ

614-43-424-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-41-001000

614-43-624-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,669 -

RFQ

614-43-624-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-432-41-780000

104-13-432-41-780000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
3,924 -

RFQ

104-13-432-41-780000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-632-41-780000

104-13-632-41-780000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
3,615 -

RFQ

104-13-632-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
110-93-322-41-801000

110-93-322-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,303 -

RFQ

110-93-322-41-801000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-322-41-801000

110-43-322-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,670 -

RFQ

110-43-322-41-801000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-636-41-007000

116-93-636-41-007000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,439 -

RFQ

116-93-636-41-007000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-636-41-007000

116-43-636-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,186 -

RFQ

116-43-636-41-007000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-640-31-002000

614-41-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,613 -

RFQ

614-41-640-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-640-31-002000

614-91-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,506 -

RFQ

614-91-640-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-149-15-063135

546-83-149-15-063135

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,690 -

RFQ

546-83-149-15-063135

Ficha técnica

Bulk 546 Active PGA 149 (15 x 15) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-149-15-063136

546-83-149-15-063136

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,935 -

RFQ

546-83-149-15-063136

Ficha técnica

Bulk 546 Active PGA 149 (15 x 15) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
44-6556-10

44-6556-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics
2,603 -

RFQ

44-6556-10

Ficha técnica

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
22-7400-10

22-7400-10

CONN SOCKET SIP 22POS TIN

Aries Electronics
2,209 -

RFQ

22-7400-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 22 (1 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-0508-20

35-0508-20

CONN SOCKET SIP 35POS GOLD

Aries Electronics
3,239 -

RFQ

35-0508-20

Ficha técnica

Bulk 508 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
35-0508-30

35-0508-30

CONN SOCKET SIP 35POS GOLD

Aries Electronics
3,567 -

RFQ

35-0508-30

Ficha técnica

Bulk 508 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
Total 21991 Record«Prev1... 451452453454455456457458...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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