Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-43-316-41-003000

126-43-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,754 -

RFQ

126-43-316-41-003000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6823-90

24-6823-90

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,218 -

RFQ

24-6823-90

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6823-90T

28-6823-90T

CONN IC DIP SOCKET 28POS TIN

Aries Electronics
3,825 -

RFQ

28-6823-90T

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-0511-11

14-0511-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics
2,473 -

RFQ

14-0511-11

Ficha técnica

Bulk 511 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
111-47-950-41-001000

111-47-950-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,891 -

RFQ

111-47-950-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-430-41-003000

127-93-430-41-003000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.
3,035 -

RFQ

127-93-430-41-003000

Ficha técnica

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-430-41-003000

127-43-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,501 -

RFQ

127-43-430-41-003000

Ficha técnica

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-432-41-004000

612-41-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,402 -

RFQ

612-41-432-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-632-41-004000

612-41-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,507 -

RFQ

612-41-632-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-432-41-004000

612-91-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,328 -

RFQ

612-91-432-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-632-41-004000

612-91-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,119 -

RFQ

612-91-632-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-0503-21

20-0503-21

CONN SOCKET SIP 20POS GOLD

Aries Electronics
2,610 -

RFQ

20-0503-21

Ficha técnica

Bulk 0503 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
20-0503-31

20-0503-31

CONN SOCKET SIP 20POS GOLD

Aries Electronics
2,695 -

RFQ

20-0503-31

Ficha técnica

Bulk 0503 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
111-93-952-41-001000

111-93-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,644 -

RFQ

111-93-952-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-952-41-001000

111-43-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,134 -

RFQ

111-43-952-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-361-19-000101

510-83-361-19-000101

CONN SOCKET PGA 361POS GOLD

Preci-Dip
3,738 -

RFQ

510-83-361-19-000101

Ficha técnica

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-93-640-41-012000

146-93-640-41-012000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,290 -

RFQ

146-93-640-41-012000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-640-41-012000

146-43-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,237 -

RFQ

146-43-640-41-012000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-822-90E

18-822-90E

CONN IC DIP SOCKET 18POS TIN

Aries Electronics
2,314 -

RFQ

18-822-90E

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
126-93-432-41-001000

126-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,860 -

RFQ

126-93-432-41-001000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 470471472473474475476477...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário