Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-0511-11

20-0511-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics
3,335 -

RFQ

20-0511-11

Ficha técnica

Bulk 511 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
614-41-652-31-012000

614-41-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,292 -

RFQ

614-41-652-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-31-012000

614-91-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,455 -

RFQ

614-91-652-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-642-41-780000

104-13-642-41-780000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,400 -

RFQ

104-13-642-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
517-87-403-19-111111

517-87-403-19-111111

CONN SOCKET PGA 403POS GOLD

Preci-Dip
3,636 -

RFQ

517-87-403-19-111111

Ficha técnica

Bulk 517 Active PGA 403 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-648-31-002000

614-41-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,980 -

RFQ

614-41-648-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-648-31-002000

614-91-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,990 -

RFQ

614-91-648-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-964-41-001000

115-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
3,010 -

RFQ

115-93-964-41-001000

Ficha técnica

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-964-41-001000

115-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,080 -

RFQ

115-43-964-41-001000

Ficha técnica

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-432-41-004000

612-43-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,370 -

RFQ

612-43-432-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-632-41-004000

612-43-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,611 -

RFQ

612-43-632-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-432-41-004000

612-93-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,945 -

RFQ

612-93-432-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-632-41-004000

612-93-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,892 -

RFQ

612-93-632-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3575-10

28-3575-10

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics
3,626 -

RFQ

28-3575-10

Ficha técnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6575-10

28-6575-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
2,453 -

RFQ

28-6575-10

Ficha técnica

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-1508-20

40-1508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,386 -

RFQ

40-1508-20

Ficha técnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
40-1508-30

40-1508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,572 -

RFQ

40-1508-30

Ficha técnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
48-6511-11

48-6511-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
3,703 -

RFQ

48-6511-11

Ficha técnica

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-41-636-41-004000

612-41-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,798 -

RFQ

612-41-636-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-636-41-004000

612-91-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,883 -

RFQ

612-91-636-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 507508509510511512513514...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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