Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-012-05-001001

510-91-012-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,763 -

RFQ

510-91-012-05-001001

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-012-05-001002

510-91-012-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,703 -

RFQ

510-91-012-05-001002

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-012-05-001003

510-91-012-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,227 -

RFQ

510-91-012-05-001003

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-310-61-001000

110-13-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,028 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-44-306-61-003000

115-44-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,457 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-43-210-61-001000

111-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,202 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-210-61-001000

111-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,637 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-952-41-007000

116-93-952-41-007000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,581 -

RFQ

116-93-952-41-007000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-007000

116-43-952-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,993 -

RFQ

116-43-952-41-007000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
180-PGM18006-10

180-PGM18006-10

PIN GRID ARRAY SOCKET 180PIN

Aries Electronics
3,222 -

RFQ

- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-149-15-063112

614-83-149-15-063112

CONN SOCKET PGA 149POS GOLD

Preci-Dip
3,133 -

RFQ

614-83-149-15-063112

Ficha técnica

Bulk 614 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
104-13-652-41-780000

104-13-652-41-780000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,996 -

RFQ

104-13-652-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
126-93-642-41-002000

126-93-642-41-002000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,583 -

RFQ

126-93-642-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-642-41-002000

126-43-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,925 -

RFQ

126-43-642-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-101-13-061001

510-93-101-13-061001

PGA SOCK 101PIN 13X13 SOLDER TL

Mill-Max Manufacturing Corp.
2,878 -

RFQ

Tube 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-088-13-081001

510-93-088-13-081001

PGA SOCK 88PIN 13X13 SOLDER TL

Mill-Max Manufacturing Corp.
3,614 -

RFQ

Tube 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-088-13-062001

510-93-088-13-062001

SOCKET SOLDERTAIL 88-PGA

Mill-Max Manufacturing Corp.
3,436 -

RFQ

Tube 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-0501-21

30-0501-21

CONN SOCKET SIP 30POS GOLD

Aries Electronics
2,337 -

RFQ

30-0501-21

Ficha técnica

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-0501-31

30-0501-31

CONN SOCKET SIP 30POS GOLD

Aries Electronics
3,380 -

RFQ

30-0501-31

Ficha técnica

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-0501-20

39-0501-20

CONN SOCKET SIP 39POS TIN

Aries Electronics
3,886 -

RFQ

39-0501-20

Ficha técnica

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 541542543544545546547548...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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