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| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICF-632-S-O-TRCONN IC DIP SOCKET 32POS TIN Samtec Inc. |
273 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-308-SGGCONN IC DIP SOCKET 8POS GOLD Samtec Inc. |
568 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
ICF-640-S-OCONN IC DIP SOCKET 40POS TIN Samtec Inc. |
794 | - |
RFQ |
Ficha técnica |
Tube | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICF-308-T-OCONN IC DIP SOCKET 8POS TIN Samtec Inc. |
3,892 | - |
RFQ |
Ficha técnica |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-308-SSTCONN IC DIP SOCKET 8POS GOLD Samtec Inc. |
961 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-320-STTCONN IC DIP SKT 20POS Samtec Inc. |
142 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-308-SGTCONN IC DIP SOCKET 8POS GOLD Samtec Inc. |
2,488 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICA-314-SSTCONN IC DIP SOCKET 14POS GOLD Samtec Inc. |
989 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICA-628-STTCONN IC DIP SOCKET 28POS TIN Samtec Inc. |
3,577 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-314-SGTCONN IC DIP SOCKET 14POS GOLD Samtec Inc. |
3,880 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
|
ICF-308-S-OCONN IC DIP SOCKET 8POS TIN Samtec Inc. |
3,649 | - |
RFQ |
Ficha técnica |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICO-316-SGTCONN IC DIP SOCKET 16POS GOLD Samtec Inc. |
2,560 | - |
RFQ |
Ficha técnica |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-316-SGTCONN IC DIP SKT 16POS Samtec Inc. |
2,101 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-640-STTCONN IC DIP SOCKET 40POS TIN Samtec Inc. |
3,057 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
APO-308-G-HCONN DIP ADAPT 8POS Samtec Inc. |
3,631 | - |
RFQ |
Bulk | APO | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
ICO-640-SGTCONN IC DIP SOCKET 40POS GOLD Samtec Inc. |
2,338 | - |
RFQ |
Ficha técnica |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-314-SGGCONN IC DIP SOCKET 14POS GOLD Samtec Inc. |
2,892 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
ICF-318-T-OCONN IC DIP SOCKET 18POS TIN Samtec Inc. |
2,551 | - |
RFQ |
Ficha técnica |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-628-SGGCONN IC DIP SOCKET 28POS GOLD Samtec Inc. |
2,577 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
ICA-640-SGGCONN IC DIP SOCKET 40POS GOLD Samtec Inc. |
2,785 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
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