Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-424-41-003000

116-41-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,022 -

RFQ

116-41-424-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-624-41-003000

116-41-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,329 -

RFQ

116-41-624-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-324-41-003000

116-91-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,577 -

RFQ

116-91-324-41-003000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-424-41-003000

116-91-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,899 -

RFQ

116-91-424-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-624-41-003000

116-91-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,763 -

RFQ

116-91-624-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-652-41-001000

115-47-652-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,117 -

RFQ

115-47-652-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-120-41-005000

317-93-120-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
3,298 -

RFQ

317-93-120-41-005000

Ficha técnica

Tube 317 Active SIP 20 (1 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-008000

116-41-318-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,566 -

RFQ

116-41-318-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-008000

116-91-318-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,441 -

RFQ

116-91-318-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-316-11-480000

605-93-316-11-480000

SOCKET CARRIER LOWPRO .300 16POS

Mill-Max Manufacturing Corp.
3,558 -

RFQ

605-93-316-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-316-11-480000

605-43-316-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,141 -

RFQ

605-43-316-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-628-41-013000

146-41-628-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,737 -

RFQ

146-41-628-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-628-41-013000

146-91-628-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,589 -

RFQ

146-91-628-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-322-41-006000

116-93-322-41-006000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,910 -

RFQ

116-93-322-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-422-41-006000

116-93-422-41-006000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,344 -

RFQ

116-93-422-41-006000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-322-41-006000

116-43-322-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,991 -

RFQ

116-43-322-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-422-41-006000

116-43-422-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,920 -

RFQ

116-43-422-41-006000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-316-41-770000

104-13-316-41-770000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,629 -

RFQ

104-13-316-41-770000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
614-41-318-31-018000

614-41-318-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,383 -

RFQ

614-41-318-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-318-31-018000

614-91-318-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,030 -

RFQ

614-91-318-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 110111112113114115116117...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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