Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-322-41-001000

116-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,980 -

RFQ

116-93-322-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-422-41-001000

116-93-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,200 -

RFQ

116-93-422-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-322-41-001000

116-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,058 -

RFQ

116-43-322-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-422-41-001000

116-43-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,690 -

RFQ

116-43-422-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-636-41-001000

116-47-636-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,275 -

RFQ

116-47-636-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-648-41-005000

117-41-648-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,308 -

RFQ

117-41-648-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-648-41-005000

117-91-648-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,712 -

RFQ

117-91-648-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-448-41-005000

117-41-448-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,638 -

RFQ

117-41-448-41-005000

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-448-41-005000

117-91-448-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,052 -

RFQ

117-91-448-41-005000

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-322-41-003000

612-43-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,605 -

RFQ

612-43-322-41-003000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-422-41-003000

612-43-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,412 -

RFQ

612-43-422-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-322-41-003000

612-93-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,245 -

RFQ

612-93-322-41-003000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-422-41-003000

612-93-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,990 -

RFQ

612-93-422-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-132-41-012000

346-93-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.
3,213 -

RFQ

346-93-132-41-012000

Ficha técnica

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-652-41-001000

110-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,627 -

RFQ

110-13-652-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-650-41-001000

115-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,901 -

RFQ

115-93-650-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-650-41-001000

115-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,834 -

RFQ

115-43-650-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-324-41-003000

126-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,469 -

RFQ

126-93-324-41-003000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-424-41-003000

126-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,840 -

RFQ

126-93-424-41-003000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-624-41-003000

126-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,796 -

RFQ

126-93-624-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 170171172173174175176177...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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