Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-308-41-006000

116-41-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,024 -

RFQ

116-41-308-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-308-41-006000

116-91-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,245 -

RFQ

116-91-308-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-322-41-001000

110-99-322-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.
2,042 -

RFQ

110-99-322-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-422-41-001000

110-99-422-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.
3,743 -

RFQ

110-99-422-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-322-41-001000

110-44-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,591 -

RFQ

110-44-322-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-422-41-001000

110-44-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,723 -

RFQ

110-44-422-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-210-41-003000

116-41-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,045 -

RFQ

116-41-210-41-003000

Ficha técnica

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-210-41-003000

116-91-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,695 -

RFQ

116-91-210-41-003000

Ficha técnica

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-306-41-007000

116-47-306-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,340 -

RFQ

116-47-306-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-310-41-006000

116-93-310-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,618 -

RFQ

116-93-310-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-41-006000

116-43-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,068 -

RFQ

116-43-310-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-320-41-001000

210-47-320-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,488 -

RFQ

210-47-320-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-306-41-003000

115-93-306-41-003000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
3,235 -

RFQ

115-93-306-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-306-41-003000

115-43-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,710 -

RFQ

115-43-306-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-310-41-007000

116-41-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,096 -

RFQ

116-41-310-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-310-41-007000

116-91-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,946 -

RFQ

116-91-310-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-102-41-005000

317-43-102-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.
2,367 -

RFQ

317-43-102-41-005000

Ficha técnica

Bulk 317 Active SIP 2 (1 x 2) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-318-41-001000

210-47-318-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,512 -

RFQ

210-47-318-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-210-31-018000

614-41-210-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,405 -

RFQ

614-41-210-31-018000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-210-31-018000

614-91-210-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,756 -

RFQ

614-91-210-31-018000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 5354555657585960...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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