Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-41-328-41-003000

115-41-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,407 -

RFQ

115-41-328-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-628-41-003000

115-41-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,783 -

RFQ

115-41-628-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-246-31-018000

714-43-246-31-018000

CONN IC DIP SOCKET 46POS GOLD

Mill-Max Manufacturing Corp.
2,694 -

RFQ

714-43-246-31-018000

Ficha técnica

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 46 (2 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-308-41-001000

123-91-308-41-001000

SOCKET IC OPEN 3 LVL .300 8POS

Mill-Max Manufacturing Corp.
2,122 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-308-41-001000

123-41-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,525 -

RFQ

123-41-308-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-210-41-004000

612-41-210-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,262 -

RFQ

612-41-210-41-004000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-210-41-004000

612-91-210-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,736 -

RFQ

612-91-210-41-004000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-432-41-001000

110-99-432-41-001000

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.
3,891 -

RFQ

110-99-432-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-432-41-001000

110-44-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,249 -

RFQ

110-44-432-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-210-41-001000

612-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,572 -

RFQ

612-93-210-41-001000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-210-41-001000

612-43-210-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,112 -

RFQ

612-43-210-41-001000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-320-41-001000

210-11-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,847 -

RFQ

210-11-320-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-104-41-005000

317-43-104-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.
2,895 -

RFQ

317-43-104-41-005000

Ficha técnica

Bulk 317 Active SIP 4 (1 x 4) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-318-41-012000

146-41-318-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,936 -

RFQ

146-41-318-41-012000

Ficha técnica

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-318-41-012000

146-91-318-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,993 -

RFQ

146-91-318-41-012000

Ficha técnica

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-324-41-003000

115-44-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,160 -

RFQ

115-44-324-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-624-41-003000

115-44-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,820 -

RFQ

115-44-624-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-420-41-001000

111-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,621 -

RFQ

111-93-420-41-001000

Ficha técnica

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-420-41-001000

111-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,645 -

RFQ

111-43-420-41-001000

Ficha técnica

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-308-11-480000

605-41-308-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,359 -

RFQ

605-41-308-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 7273747576777879...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário