Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-91-314-41-007000

116-91-314-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,302 -

RFQ

116-91-314-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-650-41-001000

110-99-650-41-001000

CONN IC DIP SOCKET 50POS TINLEAD

Mill-Max Manufacturing Corp.
3,342 -

RFQ

110-99-650-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-650-41-001000

110-44-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,805 -

RFQ

110-44-650-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-640-41-001000

110-91-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
3,997 -

RFQ

110-91-640-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-432-41-001000

110-47-432-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,571 -

RFQ

110-47-432-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-318-41-006000

116-47-318-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,866 -

RFQ

116-47-318-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-210-41-002000

126-93-210-41-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,614 -

RFQ

126-93-210-41-002000

Ficha técnica

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-210-41-002000

126-43-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,473 -

RFQ

126-43-210-41-002000

Ficha técnica

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-306-41-001000

126-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
3,522 -

RFQ

126-93-306-41-001000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-308-41-008000

116-93-308-41-008000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,192 -

RFQ

116-93-308-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-41-008000

116-43-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,393 -

RFQ

116-43-308-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-308-41-001000

122-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,389 -

RFQ

122-13-308-41-001000

Ficha técnica

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-308-31-007000

614-41-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,029 -

RFQ

614-41-308-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-308-41-001000

614-41-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,149 -

RFQ

614-41-308-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-308-31-007000

614-91-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,657 -

RFQ

614-91-308-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-308-41-001000

614-91-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,840 -

RFQ

614-91-308-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-314-41-001000

210-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,216 -

RFQ

210-11-314-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-306-41-001000

121-13-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
2,835 -

RFQ

121-13-306-41-001000

Ficha técnica

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-314-10-002000

110-13-314-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
2,527 -

RFQ

110-13-314-10-002000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-308-11-480000

605-93-308-11-480000

SOCKET CARRIER LOWPRO .300 8POS

Mill-Max Manufacturing Corp.
2,128 -

RFQ

605-93-308-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 7879808182838485...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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