Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-43-318-61-003000

115-43-318-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,521 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-318-61-003000

115-93-318-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,961 -

RFQ

Tube * Active - - - - - - - - - - - - - -
121-13-652-41-001000

121-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,239 -

RFQ

121-13-652-41-001000

Ficha técnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-61-001000

116-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,312 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-308-61-001000

116-93-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,842 -

RFQ

Tube * Active - - - - - - - - - - - - - -
34-81150-610C

34-81150-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,273 -

RFQ

34-81150-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-81250-610C

34-81250-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
2,842 -

RFQ

34-81250-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-256M16-000166

550-10-256M16-000166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,390 -

RFQ

550-10-256M16-000166

Ficha técnica

Bulk 550 Active BGA 256 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-256M20-001166

550-10-256M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,425 -

RFQ

550-10-256M20-001166

Ficha técnica

Bulk 550 Active BGA 256 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
115-43-320-61-001000

115-43-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,954 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-420-61-001000

115-43-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,496 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-320-61-001000

115-93-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,617 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-420-61-001000

115-93-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,596 -

RFQ

Tube * Active - - - - - - - - - - - - - -
64-9518-10TE

64-9518-10TE

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
3,129 -

RFQ

64-9518-10TE

Ficha técnica

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-810-90

20-810-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,859 -

RFQ

20-810-90

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
517-87-475-21-121111

517-87-475-21-121111

CONN SOCKET PGA 475POS GOLD

Preci-Dip
2,907 -

RFQ

517-87-475-21-121111

Ficha técnica

Bulk 517 Active PGA 475 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-44-642-61-001000

110-44-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,959 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-642-61-001000

110-99-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,073 -

RFQ

Tube * Active - - - - - - - - - - - - - -
33-0501-21

33-0501-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics
3,489 -

RFQ

33-0501-21

Ficha técnica

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0501-31

33-0501-31

CONN SOCKET SIP 33POS GOLD

Aries Electronics
2,225 -

RFQ

33-0501-31

Ficha técnica

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 564565566567568569570571...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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