Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-314-61-006000

116-43-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,450 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-314-61-006000

116-93-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,762 -

RFQ

Tube * Active - - - - - - - - - - - - - -
30-81250-610C

30-81250-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,460 -

RFQ

30-81250-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8563-610C

30-8563-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,013 -

RFQ

30-8563-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8940-310C

30-8940-310C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,687 -

RFQ

30-8940-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8950-610C

30-8950-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,397 -

RFQ

30-8950-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
605-93-964-11-480000

605-93-964-11-480000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.
3,923 -

RFQ

605-93-964-11-480000

Ficha técnica

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-964-11-480000

605-43-964-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,424 -

RFQ

605-43-964-11-480000

Ficha técnica

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-950-41-001000

116-47-950-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,349 -

RFQ

116-47-950-41-001000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-652-41-002000

124-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,475 -

RFQ

124-41-652-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-952-41-002000

124-41-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,328 -

RFQ

124-41-952-41-002000

Ficha técnica

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-652-41-002000

124-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,216 -

RFQ

124-91-652-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-952-41-002000

124-91-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,095 -

RFQ

124-91-952-41-002000

Ficha técnica

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics
2,828 -

RFQ

25-0511-11

Ficha técnica

Bulk 511 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0511-11

24-0511-11

CONN SOCKET SIP 24POS GOLD

Aries Electronics
3,856 -

RFQ

24-0511-11

Ficha técnica

Bulk 511 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-44-648-61-001000

110-44-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,794 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-648-61-001000

110-99-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,404 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-324-61-003000

115-43-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,637 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-624-61-003000

115-43-624-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,975 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-324-61-003000

115-93-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,962 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 571572573574575576577578...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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