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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-43-316-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,448 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-316-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,244 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-47-964-41-001000STANDRD SOLDRTL Mill-Max Manufacturing Corp. |
2,878 | - |
RFQ |
Ficha técnica |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-324-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,659 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-424-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,659 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-624-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,321 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-324-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,625 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-424-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,162 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-624-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,936 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
1-1554653-1CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
3,192 | - |
RFQ |
Ficha técnica |
Tray,Box | - | Last Time Buy | LGA | 2011 (47 x 58) | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
24-3508-211CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,152 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3508-311CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,185 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
127-93-668-41-002000CONN IC DIP SOCKET 68POS GOLD Mill-Max Manufacturing Corp. |
3,470 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-43-668-41-002000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,795 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
28-3503-21CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,563 | - |
RFQ |
Ficha técnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3503-31CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,430 | - |
RFQ |
Ficha técnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
326-93-164-41-001000CONN SOCKET SIP 64POS GOLD Mill-Max Manufacturing Corp. |
3,461 | - |
RFQ |
Ficha técnica |
Tube | 326 | Active | SIP | 64 (1 x 64) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
APA-628-G-BADAPTER PLUG Samtec Inc. |
3,015 | - |
RFQ |
Bulk | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
126-93-650-41-003000CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp. |
2,691 | - |
RFQ |
Ficha técnica |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-93-950-41-003000CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp. |
2,412 | - |
RFQ |
Ficha técnica |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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