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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
114-83-306-41-117101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
2,827 | - |
RFQ |
Ficha técnica |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-306-41-134161CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
3,263 | - |
RFQ |
Ficha técnica |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-308-41-003101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,834 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-310-41-005101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,381 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-610-41-005101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,402 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD Preci-Dip |
2,868 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-304-41-012101CONN IC DIP SOCKET 4POS GOLD Preci-Dip |
2,132 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-304-41-009101CONN IC DIP SOCKET 4POS GOLD Preci-Dip |
2,059 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-018101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
3,899 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
121-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD Preci-Dip |
3,315 | - |
RFQ |
Ficha técnica |
Bulk | 121 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
AW 127-23/Z-TSOCKET 23 CONTACTS SINGLE ROW Assmann WSW Components |
2,881 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-24/Z-TSOCKET 24 CONTACTS SINGLE ROW Assmann WSW Components |
2,457 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AR 28-HZL/7-TTCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
3,644 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
01-0513-11CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,850 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
115-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,316 | - |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
110-83-306-41-105161CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
2,031 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-308-41-018101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
2,207 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-007101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
2,943 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-314-41-001101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
2,095 | - |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
510-83-012-05-001101CONN SOCKET PGA 12POS GOLD Preci-Dip |
3,643 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 12 (5 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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