Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-088-13-062002

510-91-088-13-062002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,592 -

RFQ

510-91-088-13-062002

Ficha técnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-088-13-062003

510-91-088-13-062003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,970 -

RFQ

510-91-088-13-062003

Ficha técnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-088-13-081002

510-91-088-13-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,075 -

RFQ

510-91-088-13-081002

Ficha técnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-088-13-081003

510-91-088-13-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,465 -

RFQ

510-91-088-13-081003

Ficha técnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-088-13-062001

510-91-088-13-062001

SOCKET SOLDERTAIL 88-PGA

Mill-Max Manufacturing Corp.
2,098 -

RFQ

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-088-13-081001

510-91-088-13-081001

SOCKET SOLDERTAIL 88-PGA

Mill-Max Manufacturing Corp.
3,094 -

RFQ

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-069-11-061001

510-43-069-11-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,176 -

RFQ

510-43-069-11-061001

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-12-051001

510-91-089-12-051001

SOCKET SOLDERTAIL 89-PGA

Mill-Max Manufacturing Corp.
2,601 -

RFQ

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-061001

510-91-089-13-061001

SOCKET SOLDERTAIL 89-PGA

Mill-Max Manufacturing Corp.
3,475 -

RFQ

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-12-051002

510-91-089-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,572 -

RFQ

510-91-089-12-051002

Ficha técnica

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-12-051003

510-91-089-12-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,433 -

RFQ

510-91-089-12-051003

Ficha técnica

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-061002

510-91-089-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,451 -

RFQ

510-91-089-13-061002

Ficha técnica

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-061003

510-91-089-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,956 -

RFQ

510-91-089-13-061003

Ficha técnica

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-082002

510-91-089-13-082002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,428 -

RFQ

510-91-089-13-082002

Ficha técnica

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-082003

510-91-089-13-082003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,273 -

RFQ

510-91-089-13-082003

Ficha técnica

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-089-13-082001

510-91-089-13-082001

SOCKET SOLDERTAIL 89-PGA

Mill-Max Manufacturing Corp.
2,078 -

RFQ

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3575-11

28-3575-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics
3,571 -

RFQ

28-3575-11

Ficha técnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6575-11

28-6575-11

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
3,624 -

RFQ

28-6575-11

Ficha técnica

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-642-61-003000

116-43-642-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,404 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-642-61-003000

116-93-642-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,148 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 621622623624625626627628...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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