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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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48-6575-16CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
3,175 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-6556-40CONN IC DIP SOCKET 44POS GOLD Aries Electronics |
2,004 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-6556-41CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
2,497 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
558-10-500M30-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,473 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-504M29-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,874 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-478M26-131104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,948 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-478M26-131105CONN SOCKET PGA 478POS GOLD Preci-Dip |
2,122 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-480M29-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,762 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-480M29-001105CONN SOCKET PGA 480POS GOLD Preci-Dip |
2,447 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
48-6556-40CONN IC DIP SOCKET 48POS GOLD Aries Electronics |
2,949 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
510-13-273-21-125001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,405 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 273 (21 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-273-21-125002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,177 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 273 (21 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-273-21-125003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,670 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 273 (21 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
192-PGM17043-10HCONN SOCKET PGA GOLD Aries Electronics |
2,817 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
42-6556-41CONN IC DIP SOCKET 42POS GOLD Aries Electronics |
2,077 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
518-77-478M26-131106CONN SOCKET PGA 478POS GOLD Preci-Dip |
3,932 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-520M31-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,430 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-480M29-001106CONN SOCKET PGA 480POS GOLD Preci-Dip |
3,353 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
100-PRS10001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,475 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
514-83-560M33-001148CONN SOCKET BGA 560POS GOLD Preci-Dip |
2,318 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 560 (33 x 33) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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