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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-641610-1CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
2,082 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | - |
|
2-641605-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,941 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641612-1CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors |
2,460 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
2-641605-4CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
3,479 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641268-1CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
2,011 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641296-2CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
3,620 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641599-2CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,069 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641600-2CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,482 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641600-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,203 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
4593CONN SOCKET TRANSIST TO-100 8POS Keystone Electronics |
3,570 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-100 | 8 (Round) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
4607CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
2,242 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
|
4609CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
2,498 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
4733COVER PWR TRANS .140ID TO-66 Keystone Electronics |
3,763 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
822114-3CONN SOCKET PQFP 144POS TIN-LEAD TE Connectivity AMP Connectors |
3,324 | - |
RFQ |
Ficha técnica |
Tube,Tube | - | Obsolete | QFP | 144 (4 x 36) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
382437-1CONN SOCKET SIP 3POS TIN TE Connectivity AMP Connectors |
3,328 | - |
RFQ |
Ficha técnica |
Bulk,Tray | Diplomate DL | Obsolete | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
643644-1CONN SOCKET SIP 12POS TIN TE Connectivity AMP Connectors |
2,669 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643648-1CONN SOCKET SIP 16POS TIN TE Connectivity AMP Connectors |
3,363 | - |
RFQ |
Tray | Diplomate DL | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | |
|
643649-1CONN SOCKET SIP 17POS TIN TE Connectivity AMP Connectors |
2,807 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643654-1CONN SOCKET SIP 22POS TIN TE Connectivity AMP Connectors |
3,946 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
643662-1CONN SOCKET SIP 30POS TIN TE Connectivity AMP Connectors |
3,308 | - |
RFQ |
Ficha técnica |
Tray,Box | Diplomate DL | Obsolete | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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