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Soquetes para CIs, Transistores

Número da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
114-83-312-41-117101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3,472	-	RFQ	Ficha técnica	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-312-41-134161 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	2,426	-	RFQ	Ficha técnica	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,715	-	RFQ	Ficha técnica	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-102-31-018000 CONN SOCKET SIP 2POS GOLD Mill-Max Manufacturing Corp.	674	-	RFQ	Ficha técnica	Bulk	714	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-304-41-013101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,298	-	RFQ	Ficha técnica	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-610-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,345	-	RFQ	Ficha técnica	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-003101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	2,832	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
05-0518-10H CONN SOCKET SIP 5POS GOLD Aries Electronics	2,123	-	RFQ	Ficha técnica	Bulk	518	Active	SIP	5 (1 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	2,120	-	RFQ	Ficha técnica	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-306-41-004101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	2,230	-	RFQ	Ficha técnica	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2,789	-	RFQ	Ficha técnica	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-312-31-012101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3,254	-	RFQ	Ficha técnica	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-007101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,905	-	RFQ	Ficha técnica	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105191 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,762	-	RFQ		Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-314-41-134191 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	3,094	-	RFQ		Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	2,187	-	RFQ	Ficha técnica	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-310-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,650	-	RFQ	Ficha técnica	Bulk	612	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-610-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,691	-	RFQ	Ficha técnica	Bulk	612	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-318-41-117101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	3,505	-	RFQ	Ficha técnica	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400-TR CONN SOCKET PLCC 32POS TIN Preci-Dip	2,453	-	RFQ	Ficha técnica	Tape & Reel (TR)	540	Active	PLCC	32 (4 x 8)	0.050 (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)