Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
540-88-084-17-400-TR

540-88-084-17-400-TR

CONN SOCKET PLCC 84POS TIN

Preci-Dip
2,647 -

RFQ

540-88-084-17-400-TR

Ficha técnica

Tape & Reel (TR) 540 Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
1051420133

1051420133

CONN SOCKET LGA 2011POS GOLD

Molex
3,239 -

RFQ

1051420133

Ficha técnica

Tray 105142 Obsolete LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) - - - Thermoplastic
1109253

1109253

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,252 -

RFQ

- - Active - - - - - - - - - - - - - -
1110729-24

1110729-24

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
3,545 -

RFQ

- - Active - - - - - - - - - - - - - -
7410-101-10

7410-101-10

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,968 -

RFQ

- - Active - - - - - - - - - - - - - -
28-6553-16

28-6553-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,206 -

RFQ

28-6553-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
1109927-28

1109927-28

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,126 -

RFQ

- - Active - - - - - - - - - - - - - -
1109906-40

1109906-40

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,010 -

RFQ

- - Active - - - - - - - - - - - - - -
1108254-48

1108254-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
3,674 -

RFQ

- - Active - - - - - - - - - - - - - -
1109906-48

1109906-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,340 -

RFQ

- - Active - - - - - - - - - - - - - -
1109927-48

1109927-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,678 -

RFQ

- - Active - - - - - - - - - - - - - -
1107871-48

1107871-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
2,369 -

RFQ

- - Active - - - - - - - - - - - - - -
1109741-48

1109741-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics
3,813 -

RFQ

- - Active - - - - - - - - - - - - - -
68-PLS13117-16

68-PLS13117-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,956 -

RFQ

68-PLS13117-16

Ficha técnica

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PRS13117-16

68-PRS13117-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,341 -

RFQ

68-PRS13117-16

Ficha técnica

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS15031-16

100-PLS15031-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,839 -

RFQ

100-PLS15031-16

Ficha técnica

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PRS15031-16

100-PRS15031-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,169 -

RFQ

100-PRS15031-16

Ficha técnica

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
114-PRS13021-16

114-PRS13021-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,330 -

RFQ

114-PRS13021-16

Ficha técnica

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PLS15026-16

144-PLS15026-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,144 -

RFQ

144-PLS15026-16

Ficha técnica

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PRS15026-16

144-PRS15026-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,731 -

RFQ

144-PRS15026-16

Ficha técnica

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
Total 21991 Record«Prev1... 805806807808809810811812...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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