Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1-390261-9

1-390261-9

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,792 -

RFQ

1-390261-9

Ficha técnica

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
1-822473-4

1-822473-4

CONN SOCKET PLCC 44POS TIN

TE Connectivity AMP Connectors
2,325 -

RFQ

1-822473-4

Ficha técnica

Box - Obsolete PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic
1-1825093-1

1-1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,247 -

RFQ

1-1825093-1

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1825093-1

1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,261 -

RFQ

1825093-1

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-3

1825093-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
2,562 -

RFQ

1825093-3

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-4

1825093-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,030 -

RFQ

1825093-4

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-5

1825093-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,462 -

RFQ

1825093-5

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-6

1825093-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,219 -

RFQ

1825093-6

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825094-6

1825094-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,711 -

RFQ

1825094-6

Ficha técnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825094-7

1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,897 -

RFQ

1825094-7

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825108-2

1825108-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,353 -

RFQ

1825108-2

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825109-2

1825109-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,073 -

RFQ

1825109-2

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825108-3

1825108-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,308 -

RFQ

1825108-3

Ficha técnica

Tube,Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1-1825093-2

1-1825093-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,319 -

RFQ

1-1825093-2

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-3

1-1825094-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
2,670 -

RFQ

1-1825094-3

Ficha técnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-4

1-1825094-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,393 -

RFQ

1-1825094-4

Ficha técnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-7

1-1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,956 -

RFQ

1-1825094-7

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825109-2

1-1825109-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,600 -

RFQ

1-1825109-2

Ficha técnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825276-2

1-1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,132 -

RFQ

1-1825276-2

Ficha técnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825109-3

1-1825109-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,860 -

RFQ

1-1825109-3

Ficha técnica

Tube,Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
Total 955 Record«Prev1... 89101112131415...48Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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