Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
M48118B011000G

M48118B011000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation
921 -

RFQ

M48118B011000G

Ficha técnica

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 1.180 (29.97mm) 0.866 (22.00mm) - 1.516 (38.50mm) - - - Aluminum
M47079B011000G

M47079B011000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation
738 -

RFQ

M47079B011000G

Ficha técnica

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 0.790 (20.07mm) 0.764 (19.40mm) - 1.240 (31.50mm) - - - Aluminum
311505B00000G

311505B00000G

TO-5 PUSH-ON HEATSINK

Aavid, Thermal Division of Boyd Corporation
2,049 -

RFQ

311505B00000G

Ficha técnica

Bulk - Active Board Level Press Fit Cylindrical - - 0.317 (8.05mm) ID, 0.375 (9.52mm) OD 0.400 (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Aluminum
M49165B021000G

M49165B021000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation
539 -

RFQ

M49165B021000G

Ficha técnica

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.650 (41.91mm) 0.866 (22.00mm) - 1.260 (32.00mm) - - - Aluminum
342941

342941

COPPER HEATSINK 40X40.5X13.5MM

Aavid, Thermal Division of Boyd Corporation
2,187 -

RFQ

342941

Ficha técnica

Tray - Active Top Mount, Skived Push Pin Square, Fins 1.594 (40.50mm) 1.575 (40.00mm) - 0.531 (13.50mm) - 2.50°C/W @ 200 LFM 13.30°C/W Copper
780802F00000G

780802F00000G

78080 EXTRUSION 2.36X1.06X4.1'

Aavid, Thermal Division of Boyd Corporation
3,178 -

RFQ

780802F00000G

Ficha técnica

Box - Active Board Level, Vertical, Extrusion PC Pin Rectangular, Pin Fins 49.500 (1257.30mm) 1.063 (27.00mm) - 2.362 (60.00mm) - - - Aluminum
607602F00000G

607602F00000G

60760 EXTRUSION 1X3.25X4'

Aavid, Thermal Division of Boyd Corporation
2,466 -

RFQ

607602F00000G

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Pin Fins 48.000 (1219.20mm) 3.250 (82.55mm) - 1.000 (25.40mm) 4.0W @ 20°C - - Aluminum
782452F00000G

782452F00000G

78245 EXTRUSION 2.36X1.06X4.1'

Aavid, Thermal Division of Boyd Corporation
3,864 -

RFQ

782452F00000G

Ficha técnica

Box - Active Board Level, Vertical, Extrusion Clip and PC Pin Rectangular, Pin Fins 49.500 (1257.30mm) 1.063 (27.00mm) - 2.362 (60.00mm) - 1.60°C/W @ 200 LFM - Aluminum
622852F00000G

622852F00000G

62285 EXTRUSION 1.63X6.75X4'

Aavid, Thermal Division of Boyd Corporation
3,635 -

RFQ

622852F00000G

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 48.000 (1219.20mm) 6.750 (171.45mm) - 1.630 (41.40mm) - 0.65°C/W @ 200 LFM - Aluminum
603402F00000G

603402F00000G

60340 EXTRUSION 1.312X6.437X4'

Aavid, Thermal Division of Boyd Corporation
2,950 -

RFQ

603402F00000G

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular 48.000 (1219.20mm) - - 1.312 (33.32mm) - - - Aluminum
780152F00000G

780152F00000G

78015 EXTRUSION 1.97X1.06X4.1'

Aavid, Thermal Division of Boyd Corporation
2,459 -

RFQ

780152F00000G

Ficha técnica

Box - Active Board Level, Vertical, Extrusion Clip and PC Pin Rectangular, Pin Fins 49.500 (1257.30mm) 1.063 (27.00mm) - 1.970 (50.04mm) - - - Aluminum
623352F00000G

623352F00000G

62335 EXTRUSION 1.312X19X3'

Aavid, Thermal Division of Boyd Corporation
2,841 -

RFQ

623352F00000G

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 19.000 (482.60mm) - 1.312 (33.32mm) - - - Aluminum
647062

647062

INTEL XEON CPU COOLER 1U

Aavid, Thermal Division of Boyd Corporation
3,347 -

RFQ

Tray - Active Top Mount, Zipper Fin Bolt On Rectangular, Fins 4.252 (108.00mm) 3.071 (78.00mm) - 1.004 (25.50mm) - - - -
8922

8922

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
497 -

RFQ

Bulk - Active - - - - - - - - - - -
320205B00000G

320205B00000G

HEATSINK TO-5 1W H=.25BLK

Aavid, Thermal Division of Boyd Corporation
557 -

RFQ

320205B00000G

Ficha técnica

Bag - Obsolete Board Level Press Fit Cylindrical - - 0.305 (7.75mm) ID, 0.500 (12.70mm) OD 0.250 (6.35mm) 0.6W @ 40°C 35.00°C/W @ 200 LFM 63.00°C/W Aluminum
647064

647064

INTEL XEON CPU COOLER 2U

Aavid, Thermal Division of Boyd Corporation
2,431 -

RFQ

Tray - Active Top Mount, Zipper Fin Bolt On Rectangular, Fins 4.252 (108.00mm) 3.071 (78.00mm) - 2.519 (64.00mm) - - - Copper
342946

342946

COPPER HEATSINK 60X60X22MM

Aavid, Thermal Division of Boyd Corporation
2,309 -

RFQ

342946

Ficha técnica

Tray - Active Top Mount, Skived Push Pin Square, Fins 2.362 (60.00mm) 2.362 (60.00mm) - 0.866 (22.00mm) - 0.80°C/W @ 300 LFM 7.20°C/W Copper
576802B03900G

576802B03900G

HEATSINK TO220 CLIPON W/TAB.75

Aavid, Thermal Division of Boyd Corporation
2,901 -

RFQ

576802B03900G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.500 (12.70mm) - 0.500 (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum
574502B03300G

574502B03300G

HEATSINK TO-220 VERT MNT W/TAB

Aavid, Thermal Division of Boyd Corporation
2,179 -

RFQ

574502B03300G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.810 (20.57mm) - 0.390 (9.91mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum
576802B04100G

576802B04100G

HEATSINK TO220 CLIPON W/TAB.75

Aavid, Thermal Division of Boyd Corporation
2,411 -

RFQ

576802B04100G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.500 (12.70mm) - 0.500 (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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