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Microcontrolador incorporado Microprocessador Módulos FPGA
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | RoHS | Speed | RAM Size | Flash Size | Part Status | Co-Processor | Connector Type | Core Processor | Size / Dimension | Module/Board Type | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TE0803-03-4DE21-LMODULE SOM TE0803-03 Trenz Electronic GmbH |
2,130 | - |
RFQ |
Ficha técnica |
Bulk | TE0803 | RoHS | - | 4GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
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TE0803-02-04EG-1E3IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
2,557 | - |
RFQ |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU4EG-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C | |
|
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TE0803-02-03-1EA-SIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
2,333 | - |
RFQ |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | FPGA Core | 0°C ~ 85°C | |
|
|
TE0803-02-03EG-1EAIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,228 | - |
RFQ |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C | |
|
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TE0803-02-03CG-1EAMODULE SOM TE0803-02 Trenz Electronic GmbH |
2,290 | - |
RFQ |
Bulk | TE0803 | RoHS | - | - | - | Obsolete | - | B2B | - | 2.05" x 2.99" (52mm x 76mm) | MPU Core | - | |
|
|
TE0803-03-5DI21-AMODULE SOM TE0803-03 Trenz Electronic GmbH |
2,117 | - |
RFQ |
Bulk | RoHS | - | - | - | Obsolete | - | - | - | - | - | - | ||
|
|
TE0803-02-04EG-1IDMODULE SOM TE0803-02 Trenz Electronic GmbH |
2,744 | - |
RFQ |
Bulk | TE0803 | RoHS | - | - | - | Obsolete | - | B2B | - | 2.05" x 2.99" (52mm x 76mm) | MPU Core | - | |
|
|
TE0803-03-4BE21-LMODULE SOM TE0803-03 Trenz Electronic GmbH |
3,714 | - |
RFQ |
Bulk | RoHS | - | - | - | Active | - | - | - | - | - | - | ||
|
|
TE0803-03-5DE11-AMODULE SOM TE0803-03 Trenz Electronic GmbH |
3,650 | - |
RFQ |
Ficha técnica |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU5EV-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0803-02-05EV-1EAIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,025 | - |
RFQ |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU5EV-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C | |
|
TE0890-01-25-1CIC MOD SPARTAN-7 100MHZ 64MBIT Trenz Electronic GmbH |
2,113 | - |
RFQ |
Ficha técnica |
Box | TE0890 | RoHS | 100MHz | 64Mbit | 64Mbit | Obsolete | - | Dual-pinout DIP-40 or 50mil 80 pin connector | Xilinx Spartan-7 XC7S25 | 1.06" x 2.05" (27.0mm x 52.0mm) | FPGA Core | 0°C ~ 70°C |
|
TE0745-02-81C11-ASOM MIT XILINX ZYNQ Trenz Electronic GmbH |
3,570 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 32MB | Obsolete | Zynq-7000 (Z-7035) | Samtec ST5 | ARM® Cortex®-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
TE0745-02-71I11-ASOM DDR3 1GB ZYNQ Trenz Electronic GmbH |
3,441 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 64MB | Obsolete | Zynq-7000 (Z-7030) | Samtec ST5 | ARM® Cortex®-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0807-02-4BE21-AIC MODULE ZYNQ USCALE Trenz Electronic GmbH |
3,206 | - |
RFQ |
Bulk | RoHS | - | - | - | Obsolete | - | - | - | - | - | - | ||
|
|
TE0807-02-04EG-1EIC MODULE ZYNQ USCALE Trenz Electronic GmbH |
3,043 | - |
RFQ |
Bulk | RoHS | - | - | - | Obsolete | - | - | - | - | - | - | ||
|
|
TE0841-02-0401ILIC MODULE Trenz Electronic GmbH |
2,161 | - |
RFQ |
Bulk | TE0841 | RoHS | - | 2GB | 64MB | Obsolete | - | B2B | Kintex UltraScale KU40 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0841-02-31I21-AIC MODULE Trenz Electronic GmbH |
2,685 | - |
RFQ |
Ficha técnica |
Bulk | TE0841 | RoHS | - | 2GB | 64MB | Active | - | B2B | Kintex UltraScale KU035 | 1.97" x 1.57" (50mm x 40mm) | FPGA Core | -40°C ~ 85°C |
|
|
TEC0850-03-15EG1EAIC MODULE Trenz Electronic GmbH |
2,090 | - |
RFQ |
Bulk | TEC0850 | RoHS | - | 8GB | 128MB | Obsolete | - | CompactPCI Serial Backplane | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | MCU, FPGA | - | |
|
|
TEC0850-03-BBEX1-CIC MODULE Trenz Electronic GmbH |
3,484 | - |
RFQ |
Bulk | RoHS | - | - | - | Active | - | - | - | - | - | - | ||
|
|
TE0841-02-41I21-LIC MODULE Trenz Electronic GmbH |
3,848 | - |
RFQ |
Ficha técnica |
Bulk | TE0841 | RoHS | - | 2GB | 64MB | Active | - | B2B | Kintex UltraScale KU040 | 1.97" x 1.57" (50mm x 40mm) | FPGA Core | -40°C ~ 85°C |
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