Microcontrolador incorporado Microprocessador Módulos FPGA

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
TE0841-02-31C21-A

TE0841-02-31C21-A

IC MODULE

Trenz Electronic GmbH
3,666 -

RFQ

TE0841-02-31C21-A

Ficha técnica

Bulk TE0841 RoHS - 2GB 64MB Active - B2B Kintex UltraScale KU035 1.97" x 1.57" (50mm x 40mm) FPGA Core 0°C ~ 70°C
TEC0850-03-BBEX1-A

TEC0850-03-BBEX1-A

IC MODULE

Trenz Electronic GmbH
3,705 -

RFQ

Bulk RoHS - - - Active - - - - - -
TEC0850-03-015EG1E

TEC0850-03-015EG1E

IC MODULE

Trenz Electronic GmbH
3,942 -

RFQ

Bulk TEC0850 RoHS - 8GB 128MB Obsolete - CompactPCI Serial Backplane Zynq UltraScale+ XCZU15EG-1FFVB1156E - MCU, FPGA -
TE0820-03-4DE21FA

TE0820-03-4DE21FA

IC MODULE 2GB 128MB

Trenz Electronic GmbH
2,124 -

RFQ

Bulk RoHS - - - Obsolete - - - - - -
TE0808-04-9GI21-A

TE0808-04-9GI21-A

IC MODULE ZYNQ USCALE 4GB 128MB

Trenz Electronic GmbH
3,854 -

RFQ

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU9EG-2FFVC900I 2.05" x 2.99" (52mm x 76mm) MPU Core -40°C ~ 85°C
TE0808-04-6BE21-A

TE0808-04-6BE21-A

IC MODULE ZYNQ USCALE 4GB 128MB

Trenz Electronic GmbH
2,309 -

RFQ

Bulk TE0808 RoHS - 4GB 128MB Discontinued at Digi-Key - B2B Zynq UltraScale+ XCZU6EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-9BE21-A

TE0808-04-9BE21-A

IC MODULE ZYNQ USCALE 4GB 128MB

Trenz Electronic GmbH
3,668 -

RFQ

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-9GI21-AS

TE0808-04-9GI21-AS

STARTER KIT ZYNQ USCALE+ ZU9 FPG

Trenz Electronic GmbH
3,170 -

RFQ

TE0808-04-9GI21-AS

Ficha técnica

Box TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ ZU9 2.05" x 2.99" (52mm x 76mm) FPGA Core -40°C ~ 85°C
TE0745-02-92I11-A

TE0745-02-92I11-A

SOM 1GB DDR3 XC7Z045-2FBG676I

Trenz Electronic GmbH
2,285 -

RFQ

Bulk RoHS - - - Obsolete - - - - - -
TE0745-02-91C11-A

TE0745-02-91C11-A

SOM 1GB DDR3 XC7Z045-1FBG676C

Trenz Electronic GmbH
2,966 -

RFQ

Bulk TE0745 RoHS - 1GB 64MB Obsolete - Samtec ST5 Xilinx Zynq XC7Z045-1FBG676C 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 70°C
TE0745-02-72I11-A

TE0745-02-72I11-A

SOM 1GB DDR3 XC7Z030-2FBG676I

Trenz Electronic GmbH
2,126 -

RFQ

Bulk TE0745 RoHS - 1GB 64MB Obsolete - Samtec ST5 Xilinx Zynq XC7Z030-2FBG676I 2.05" x 2.99" (52mm x 76mm) MPU Core -40°C ~ 85°C
TE0745-02-71I11-AK

TE0745-02-71I11-AK

IC MOD SOM DDR3L 1GB ZYNQ

Trenz Electronic GmbH
3,724 -

RFQ

TE0745-02-71I11-AK

Ficha técnica

Bulk TE0745 RoHS - 1GB 64MB Obsolete Zynq-7000 (Z-7030) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA -40°C ~ 85°C
TE0745-02-30-1IA-K

TE0745-02-30-1IA-K

IC MOD SOM DDR 1GB ZYNQ

Trenz Electronic GmbH
3,065 -

RFQ

TE0745-02-30-1IA-K

Ficha técnica

Bulk TE0745 RoHS - 1GB 64MB Obsolete Zynq-7000 (Z-7030) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA -40°C ~ 85°C
TE0745-02-45-3EA

TE0745-02-45-3EA

IC MOD SOM DDR 1GB ZYNQ

Trenz Electronic GmbH
3,521 -

RFQ

TE0745-02-45-3EA

Ficha técnica

Box TE0745 RoHS - 1GB 64MB Obsolete Zynq-7000 (Z-7045) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA 0°C ~ 85°C
TE0745-02-93E11-A

TE0745-02-93E11-A

IC MOD SOM DDR3L 1GB ZYNQ

Trenz Electronic GmbH
3,580 -

RFQ

TE0745-02-93E11-A

Ficha técnica

Bulk TE0745 RoHS - 1GB 64MB Obsolete Zynq-7000 (Z-7045) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA 0°C ~ 85°C
TE0808-04-06EG-1E3

TE0808-04-06EG-1E3

IC MOD SOM MPSOC

Trenz Electronic GmbH
2,643 -

RFQ

TE0808-04-06EG-1E3

Ficha técnica

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU6EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-15EG-1EK

TE0808-04-15EG-1EK

IC MOD SOM MPSOC

Trenz Electronic GmbH
2,582 -

RFQ

TE0808-04-15EG-1EK

Ficha técnica

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU15EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-06EG-1EK

TE0808-04-06EG-1EK

IC MOD SOM MPSOC

Trenz Electronic GmbH
3,622 -

RFQ

TE0808-04-06EG-1EK

Ficha técnica

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU6EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-9BE21-AK

TE0808-04-9BE21-AK

IC MOD SOM MPSOC 4GB ZU9EG-E

Trenz Electronic GmbH
3,328 -

RFQ

TE0808-04-9BE21-AK

Ficha técnica

Bulk TE0808 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0808-04-09EG-1EL

TE0808-04-09EG-1EL

IC MOD SOM MPSOC

Trenz Electronic GmbH
2,440 -

RFQ

TE0808-04-09EG-1EL

Ficha técnica

Bulk TE0808 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
Total 446 Record«Prev12345678...23Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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