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Interface - Expansores de E/S
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | NumberofI/O | Interface | InterruptOutput | Features | OutputType | Current-OutputSource/Sink | ClockFrequency | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MCP23S08T-E/SOIC I/O EXPANDER SPI 8B 18SOIC Microchip Technology |
3,174 | - |
RFQ |
Ficha técnica |
18-SOIC (0.295, 7.50mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23008-E/PIC I/O EXPANDER I2C 8B 18DIP Microchip Technology |
4,226 | - |
RFQ |
Ficha técnica |
18-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Through Hole |
|
|
MCP23S08-E/PIC I/O EXPANDER SPI 8B 18DIP Microchip Technology |
15,669 | - |
RFQ |
Ficha técnica |
18-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Through Hole |
|
MCP25020-I/SLIC I/O EXPANDER CAN 8B 14SOIC Microchip Technology |
456 | - |
RFQ |
Ficha técnica |
14-SOIC (0.154, 3.90mm Width) | Tube | - | Active | 8 | CAN V2.0b | No | EEPROM, POR, PWM | Push-Pull | 25mA | 25 MHz | 2.75V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
MIC74YQSIC I/O EXPANDER I2C 8B 16QSOP Microchip Technology |
237 | - |
RFQ |
Ficha técnica |
16-SSOP (0.154, 3.90mm Width) | Tube | - | Active | 8 | I²C, SMBus | Yes | Fan Speed Controller | Open Drain, Push-Pull | 7mA, 10mA | 100 kHz | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
MCP25020-I/PIC I/O EXPANDER CAN 8B 14DIP Microchip Technology |
146 | - |
RFQ |
Ficha técnica |
14-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | CAN V2.0b | No | EEPROM, POR, PWM | Push-Pull | 25mA | 25 MHz | 2.75V ~ 5.5V | -40°C ~ 85°C | Through Hole |
|
|
MCP25025-I/PIC I/O EXPANDER CAN 8B 14DIP Microchip Technology |
160 | - |
RFQ |
Ficha técnica |
14-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | CAN (1-Wire) | No | EEPROM, POR, PWM | Push-Pull | 25mA | 4 MHz | 2.7V ~ 5.5V | -40°C ~ 85°C | Through Hole |
|
|
MCP25055-I/PIC I/O EXPANDER CAN 8B 14DIP Microchip Technology |
116 | - |
RFQ |
Ficha técnica |
14-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | CAN (1-Wire) | No | ADC, EEPROM, POR, PWM | Push-Pull | 25mA | 25 MHz | 2.7V ~ 5.5V | -40°C ~ 85°C | Through Hole |
|
|
MIC74YQS-TRIC I/O EXPANDER I2C 8B 16QSOP Microchip Technology |
2,150 | - |
RFQ |
Ficha técnica |
16-SSOP (0.154, 3.90mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | I²C, SMBus | Yes | Fan Speed Controller | Open Drain, Push-Pull | 7mA, 10mA | 100 kHz | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
MCP25050T-I/SLIC I/O EXPANDER CAN 8B 14SOIC Microchip Technology |
2,724 | - |
RFQ |
Ficha técnica |
14-SOIC (0.154, 3.90mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | CAN V2.0b | No | ADC, EEPROM, POR, PWM | Push-Pull | 25mA | 25 MHz | 2.7V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MCP23009-E/PIC I/O EXPANDER I2C 8B 18DIP Microchip Technology |
325 | - |
RFQ |
Ficha técnica |
18-DIP (0.300, 7.62mm) | Tube | - | Active | 8 | I²C | Yes | POR | Open Drain | 25mA | 3.4 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Through Hole |
|
|
MCP23008T-E/SOIC I/O EXPANDER I2C 8B 18SOIC Microchip Technology |
2,507 | - |
RFQ |
Ficha técnica |
18-SOIC (0.295, 7.50mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23008T-E/SSIC I/O EXPANDER 8BIT I2C 20-SSOP Microchip Technology |
3,799 | - |
RFQ |
Ficha técnica |
20-SSOP (0.209, 5.30mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23008T-E/MLIC I/O EXPANDER I2C 8B 20QFN Microchip Technology |
2,197 | - |
RFQ |
Ficha técnica |
20-VFQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S08T-E/SSIC I/O EXPANDER SPI 8B 20SSOP Microchip Technology |
3,587 | - |
RFQ |
Ficha técnica |
20-SSOP (0.209, 5.30mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23017T-E/SOIC I/O EXPANDER I2C 16B 28SOIC Microchip Technology |
3,954 | - |
RFQ |
Ficha técnica |
28-SOIC (0.295, 7.50mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S17T-E/SOIC I/O EXPANDER SPI 16B 28SOIC Microchip Technology |
3,744 | - |
RFQ |
Ficha técnica |
28-SOIC (0.295, 7.50mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23S17T-E/SSIC I/O EXPANDER SPI 16B 28SSOP Microchip Technology |
3,043 | - |
RFQ |
Ficha técnica |
28-SSOP (0.209, 5.30mm Width) | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | SPI | Yes | - | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23008-E/SOIC I/O EXPANDER I2C 8B 18SOIC Microchip Technology |
2,650 | - |
RFQ |
Ficha técnica |
18-SOIC (0.295, 7.50mm Width) | Tube | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23017T-E/MLIC I/O EXPANDER I2C 16B 28QFN Microchip Technology |
2,665 | - |
RFQ |
Ficha técnica |
28-VQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
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