+86 075582561136
Carregar BOM
Interface - Expansores de E/S
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | NumberofI/O | Interface | InterruptOutput | Features | OutputType | Current-OutputSource/Sink | ClockFrequency | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MCP23008-E/SSIC I/O EXPANDER I2C 8B 20SSOP Microchip Technology |
2,955 | - |
RFQ |
Ficha técnica |
20-SSOP (0.209, 5.30mm Width) | Tube | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23008-E/MLIC I/O EXPANDER I2C 8B 20QFN Microchip Technology |
2,779 | - |
RFQ |
Ficha técnica |
20-VFQFN Exposed Pad | Tube | - | Active | 8 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S08T-E/MLIC I/O EXPANDER SPI 8B 20QFN Microchip Technology |
3,031 | - |
RFQ |
Ficha técnica |
20-VFQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23S17T-E/MLIC I/O EXPANDER SPI 16B 28QFN Microchip Technology |
2,996 | - |
RFQ |
Ficha técnica |
28-VQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23018T-E/MJIC I/O EXPANDER I2C 16B 24QFN Microchip Technology |
2,529 | - |
RFQ |
Ficha técnica |
24-VFQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | I²C | Yes | POR | Open Drain | 25mA | 3.4 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23S08-E/SOIC I/O EXPANDER SPI 8B 18SOIC Microchip Technology |
3,654 | - |
RFQ |
Ficha técnica |
18-SOIC (0.295, 7.50mm Width) | Tube | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S08-E/SSIC I/O EXPANDER SPI 8B 20SSOP Microchip Technology |
2,683 | - |
RFQ |
Ficha técnica |
20-SSOP (0.209, 5.30mm Width) | Tube | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23S09T-E/MGIC I/O EXPANDER SPI 8B 16QFN Microchip Technology |
3,534 | - |
RFQ |
Ficha técnica |
16-VFQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 8 | SPI | Yes | - | Open Drain | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23009-E/SSIC I/O EXPANDER I2C 8B 20SSOP Microchip Technology |
581 | - |
RFQ |
Ficha técnica |
20-SSOP (0.209, 5.30mm Width) | Tube | - | Active | 8 | I²C | Yes | POR | Open Drain | 25mA | 3.4 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23017-E/SOIC I/O EXPANDER I2C 16B 28SOIC Microchip Technology |
3,008 | - |
RFQ |
Ficha técnica |
28-SOIC (0.295, 7.50mm Width) | Tube | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23009-E/MGIC I/O EXPANDER I2C 8B 16QFN Microchip Technology |
3,178 | - |
RFQ |
Ficha técnica |
16-VFQFN Exposed Pad | Tube | - | Active | 8 | I²C | Yes | POR | Open Drain | 25mA | 3.4 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S18T-E/MJIC I/O EXPANDER SPI 16B 24QFN Microchip Technology |
2,867 | - |
RFQ |
Ficha técnica |
24-VFQFN Exposed Pad | Tape & Reel (TR),Cut Tape (CT) | - | Active | 16 | SPI | Yes | - | Open Drain | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S08-E/MLIC I/O EXPANDER SPI 8B 20QFN Microchip Technology |
3,407 | - |
RFQ |
Ficha técnica |
20-VFQFN Exposed Pad | Tube | - | Active | 8 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
MCP23017-E/SPIC I/O EXPANDER I2C 16B 28SDIP Microchip Technology |
2,631 | - |
RFQ |
Ficha técnica |
28-DIP (0.300, 7.62mm) | Tube | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Through Hole |
|
MCP23017-E/SSIC I/O EXPANDER I2C 16B 28SSOP Microchip Technology |
2,933 | - |
RFQ |
Ficha técnica |
28-SSOP (0.209, 5.30mm Width) | Tube | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S17-E/SOIC I/O EXPANDER SPI 16B 28SOIC Microchip Technology |
2,771 | - |
RFQ |
Ficha técnica |
28-SOIC (0.295, 7.50mm Width) | Tube | - | Active | 16 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S09-E/MGIC I/O EXPANDER SPI 8B 16QFN Microchip Technology |
3,055 | - |
RFQ |
Ficha técnica |
16-VFQFN Exposed Pad | Tube | - | Active | 8 | SPI | Yes | - | Open Drain | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23S17-E/SPIC I/O EXPANDER SPI 16B 28SDIP Microchip Technology |
1,073 | - |
RFQ |
Ficha técnica |
28-DIP (0.300, 7.62mm) | Tube | - | Active | 16 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Through Hole |
|
|
MCP23S17-E/SSIC I/O EXPANDER SPI 16B 28SSOP Microchip Technology |
2,965 | - |
RFQ |
Ficha técnica |
28-SSOP (0.209, 5.30mm Width) | Tube | - | Active | 16 | SPI | Yes | POR | Push-Pull | 25mA | 10 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
|
|
MCP23017-E/MLIC I/O EXPANDER I2C 16B 28QFN Microchip Technology |
3,657 | - |
RFQ |
Ficha técnica |
28-VQFN Exposed Pad | Tube | - | Active | 16 | I²C | Yes | POR | Push-Pull | 25mA | 1.7 MHz | 1.8V ~ 5.5V | -40°C ~ 125°C | Surface Mount |
- 1500+ Média diária de RFQ
- 20,000.000 Unidade padrão do produto
- 1800+ Fabricantes em todo o mundo
- 15,000+ Armazém em estoque
