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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
499-87-246-10-003101

499-87-246-10-003101

CONN SOCKET 46P 0.1 GOLD PCB R/A

Preci-Dip 		2,045 -

RFQ

499-87-246-10-003101

Ficha técnica

 Bulk 499 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold Flash Black 0.200 (5.08mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
326-83-121-41-003101

326-83-121-41-003101

CONN SOCKET 21POS 0.1 GOLD PCB

Preci-Dip 		3,332 -

RFQ

326-83-121-41-003101

Ficha técnica

 Bulk 326 Active Socket Female Socket Board to Board 21 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 29.5µin (0.75µm) Black 0.661 (16.80mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-125-02-L-D-BE-A-K-TR

CLM-125-02-L-D-BE-A-K-TR

CONN RCPT 50POS 0.039 GOLD SMD

Samtec Inc. 		2,525 -

RFQ

CLM-125-02-L-D-BE-A-K-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle, Bottom Entry Female Socket Board to Board 50 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-120-02-L-DH-TR

CLP-120-02-L-DH-TR

CONN RCPT 40P 0.05 GOLD SMD R/A

Samtec Inc. 		2,630 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-120-02-LM-DH-TR

CLP-120-02-LM-DH-TR

CONN RCPT 40P 0.05 GOLD SMD R/A

Samtec Inc. 		3,573 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-140-02-F-D-BE-P-TR

CLP-140-02-F-D-BE-P-TR

CONN RCPT 80POS 0.05 GOLD SMD

Samtec Inc. 		3,976 -

RFQ

CLP-140-02-F-D-BE-P-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle, Bottom Entry Female Socket Board to Board 80 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-116-02-H-D-BE-A-P-TR

CLT-116-02-H-D-BE-A-P-TR

CONN RCPT 32POS 0.079 GOLD SMD

Samtec Inc. 		3,160 -

RFQ

CLT-116-02-H-D-BE-A-P-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 32 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
SSM-108-L-DV-A

SSM-108-L-DV-A

CONN RCPT 16POS 0.1 GOLD SMD

Samtec Inc. 		3,505 -

RFQ

SSM-108-L-DV-A

Ficha técnica

 Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CES-123-01-S-S

CES-123-01-S-S

CONN RCPT 23POS 0.1 GOLD PCB

Samtec Inc. 		3,873 -

RFQ

CES-123-01-S-S

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 23 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-114-L-DV

SSM-114-L-DV

CONN RCPT 28POS 0.1 GOLD SMD

Samtec Inc. 		3,886 -

RFQ

SSM-114-L-DV

Ficha técnica

 Bulk SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 28 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSQ-130-01-T-D

SSQ-130-01-T-D

CONN RCPT 60POS 0.1 TIN PCB

Samtec Inc. 		3,810 -

RFQ

SSQ-130-01-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-129-02-T-D

SSQ-129-02-T-D

CONN RCPT 58POS 0.1 TIN PCB

Samtec Inc. 		3,391 -

RFQ

SSQ-129-02-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 58 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-130-01-S-S

SSW-130-01-S-S

CONN RCPT 30POS 0.1 GOLD PCB

Samtec Inc. 		3,528 -

RFQ

SSW-130-01-S-S

Ficha técnica

 Bulk SSW Active Receptacle Forked Board to Board or Cable 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-43-018-20-001000

801-43-018-20-001000

CONN RCPT 18POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp. 		3,464 -

RFQ

801-43-018-20-001000

Ficha técnica

 Bulk 801 Active Receptacle Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100 (2.54mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-93-018-20-001000

801-93-018-20-001000

CONN RCPT 18POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp. 		2,738 -

RFQ

801-93-018-20-001000

Ficha técnica

 Bulk 801 Active Receptacle Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100 (2.54mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - -
CLP-108-02-LM-D-PA

CLP-108-02-LM-D-PA

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc. 		3,297 -

RFQ

Bulk CLP Active Receptacle Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESD-105-T-06

ESD-105-T-06

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc. 		2,273 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.215 (5.46mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-400

ESQT-106-02-L-D-400

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,473 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.450 (11.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-420

ESQT-106-02-L-D-420

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,546 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.420 (10.67mm) 0.430 (10.92mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-450

ESQT-106-02-L-D-450

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,312 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.450 (11.43mm) 0.400 (10.16mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+ Média diária de RFQ
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1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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