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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-02-L-D-720

ESQT-106-02-L-D-720

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,850 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-730

ESQT-106-02-L-D-730

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,962 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.730 (18.54mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-732

ESQT-106-02-L-D-732

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,259 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.732 (18.59mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-740

ESQT-106-02-L-D-740

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,409 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-748

ESQT-106-02-L-D-748

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,267 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.748 (19.00mm) 0.102 (2.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
805-83-033-10-132101

805-83-033-10-132101

CONN SOCKET 33POS 0.1 GOLD PCB

Preci-Dip 		2,111 -

RFQ

805-83-033-10-132101

Ficha técnica

 Bulk 805 Active Socket Female Socket Board to Board 33 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
0447691403

0447691403

CONN RCPT 14POS 0.118 GOLD PCB

Molex 		3,751 -

RFQ

0447691403

Ficha técnica

 Tray Micro-Fit 3.0 BMI 44769 Active Receptacle Female Socket Board to Board or Cable 14 All 0.118 (3.00mm) 2 0.118 (3.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535 (13.60mm) 0.134 (3.40mm) -40°C ~ 105°C UL94 V-0 Tin 16.86mm -
855-83-033-20-001101

855-83-033-20-001101

CONN SOCKET 33P 0.05 GOLD PCB RA

Preci-Dip 		2,423 -

RFQ

855-83-033-20-001101

Ficha técnica

 Bulk 855 Active Socket Female Socket Board to Board 33 All 0.050 (1.27mm) 3 0.050 (1.27mm) Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.174 (4.42mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-87-152-41-012101

316-87-152-41-012101

CONN SOCKET 52POS 0.1 GOLD PCB

Preci-Dip 		2,861 -

RFQ

316-87-152-41-012101

Ficha técnica

 Bulk 316 Active Socket Female Socket Board to Board 52 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.354 (9.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-LM-DH

CLP-108-02-LM-DH

CONN RCPT 16P 0.05 GOLD SMD R/A

Samtec Inc. 		3,036 -

RFQ

Tube CLP Active Receptacle Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-S-D

CLP-108-02-S-D

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc. 		2,597 -

RFQ

CLP-108-02-S-D

Ficha técnica

 Tube CLP Active Receptacle Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SLW-130-01-T-D

SLW-130-01-T-D

CONN RCPT 60POS 0.1 TIN PCB

Samtec Inc. 		3,878 -

RFQ

SLW-130-01-T-D

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin 6.09mm -
SSQ-128-01-G-S

SSQ-128-01-G-S

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc. 		3,600 -

RFQ

SSQ-128-01-G-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-106-02-L-D-750

ESQT-106-02-L-D-750

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,364 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-755

ESQT-106-02-L-D-755

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,022 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.755 (19.18mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-771

ESQT-106-02-L-D-771

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.771 (19.58mm) 0.079 (2.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-M-S-324

ESQT-110-03-M-S-324

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.324 (8.23mm) 0.134 (3.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-M-S-328

ESQT-110-03-M-S-328

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,031 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.328 (8.33mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-M-S-365

ESQT-110-03-M-S-365

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		2,107 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-110-T-06

ESS-110-T-06

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc. 		3,442 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 10 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.215 (5.46mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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