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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-02-M-D-465

ESQT-106-02-M-D-465

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,927 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.465 (11.80mm) 0.385 (9.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-525

ESQT-106-02-M-D-525

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,718 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.525 (13.34mm) 0.325 (8.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-540

ESQT-106-02-M-D-540

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,809 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.540 (13.72mm) 0.310 (7.87mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-600

ESQT-106-02-M-D-600

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,892 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-605

ESQT-106-02-M-D-605

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,032 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.605 (15.37mm) 0.245 (6.22mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-650

ESQT-106-02-M-D-650

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,486 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-700

ESQT-106-02-M-D-700

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,334 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-725

ESQT-106-02-M-D-725

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,211 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.725 (18.42mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-740

ESQT-106-02-M-D-740

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,053 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-750

ESQT-106-02-M-D-750

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,633 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-760

ESQT-106-02-M-D-760

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,004 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-M-D-790

ESQT-106-02-M-D-790

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,123 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.790 (20.07mm) 0.060 (1.52mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-112-T-04

ESS-112-T-04

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc. 		2,604 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-112-T-23

ESS-112-T-23

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc. 		3,649 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-107-12-H-D

ESW-107-12-H-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc. 		2,434 -

RFQ

ESW-107-12-H-D

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
SFM-107-02-L-D-SN

SFM-107-02-L-D-SN

CONN RCPT 14POS 0.05 GOLD SMD

Samtec Inc. 		3,224 -

RFQ

SFM-107-02-L-D-SN

Ficha técnica

 Bulk Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 14 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SFM-110-L1-F-D

SFM-110-L1-F-D

CONN RCPT 20POS 0.05 GOLD PCB

Samtec Inc. 		2,816 -

RFQ

Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 20 All 0.050 (1.27mm) 2 0.050 (1.27mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.180 (4.57mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm -
SFM-110-L1-F-D-N

SFM-110-L1-F-D-N

CONN RCPT 20POS 0.05 GOLD PCB

Samtec Inc. 		2,410 -

RFQ

SFM-110-L1-F-D-N

Ficha técnica

 Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 20 All 0.050 (1.27mm) 2 0.050 (1.27mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.180 (4.57mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm -
SSM-105-S-DV-K-A

SSM-105-S-DV-K-A

CONN RCPT 10POS 0.1 GOLD SMD

Samtec Inc. 		3,602 -

RFQ

Bulk SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-105-S-DV-A-K

SSM-105-S-DV-A-K

CONN RCPT 10POS 0.1 GOLD SMD

Samtec Inc. 		2,778 -

RFQ

Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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