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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
IPS1-110-01-S-D-VS-LC-K-TR

IPS1-110-01-S-D-VS-LC-K-TR

CONN RCPT 20POS 0.1 GOLD SMD

Samtec Inc. 		3,889 -

RFQ

Tape & Reel (TR) Mini Mate® IPS1 Active Receptacle Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C - Tin - -
SEM-105-02-03.0-H-D

SEM-105-02-03.0-H-D

.8MM TIGER EYE MICRO SOCKET

Samtec Inc. 		3,247 -

RFQ

Tray Tiger Eye™ SEM Active Receptacle Female Socket Board to Board 10 All 0.031 (0.80mm) 2 0.125 (3.18mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Gold 6mm, 7mm, 10mm -
SEM-105-02-03.0-H-D-A

SEM-105-02-03.0-H-D-A

.8MM TIGER EYE MICRO SOCKET

Samtec Inc. 		2,568 -

RFQ

Tray Tiger Eye™ SEM Active Receptacle Female Socket Board to Board 10 All 0.031 (0.80mm) 2 0.125 (3.18mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Gold 6mm, 7mm, 10mm -
ESW-125-34-T-S

ESW-125-34-T-S

CONN SOCKET 25POS 0.1 TIN PCB

Samtec Inc. 		3,574 -

RFQ

ESW-125-34-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 25 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
CES-117-01-S-D

CES-117-01-S-D

CONN RCPT 34POS 0.1 GOLD PCB

Samtec Inc. 		2,932 -

RFQ

CES-117-01-S-D

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-129-01-S-S

CES-129-01-S-S

CONN RCPT 29POS 0.1 GOLD PCB

Samtec Inc. 		3,936 -

RFQ

CES-129-01-S-S

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 29 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-111-24-L-D

BSW-111-24-L-D

CONN RCPT 22POS 0.1 GOLD PCB

Samtec Inc. 		2,618 -

RFQ

BSW-111-24-L-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-103-02-H-D-A

CLM-103-02-H-D-A

CONN RCPT 6POS 0.039 GOLD SMD

Samtec Inc. 		2,434 -

RFQ

CLM-103-02-H-D-A

Ficha técnica

 Bulk CLM Active Receptacle Female Socket Board to Board 6 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-120-02-SM-D-PA-TR

CLP-120-02-SM-D-PA-TR

CONN RCPT 40POS 0.05 GOLD SMD

Samtec Inc. 		2,316 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-S-D-BE-A

CLP-108-02-S-D-BE-A

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc. 		2,278 -

RFQ

CLP-108-02-S-D-BE-A

Ficha técnica

 Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-108-34-H-S

ESQ-108-34-H-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc. 		2,440 -

RFQ

ESQ-108-34-H-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 8 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-104-03-G-D-309

ESQT-104-03-G-D-309

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,369 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-104-03-G-D-394

ESQT-104-03-G-D-394

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,523 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.394 (10.00mm) 0.064 (1.63mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-105-02-GF-D-375

ESQT-105-02-GF-D-375

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,509 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.375 (9.53mm) 0.475 (12.07mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-105-02-GF-D-452

ESQT-105-02-GF-D-452

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		2,975 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.452 (11.48mm) 0.398 (10.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-105-02-GF-D-480

ESQT-105-02-GF-D-480

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		2,349 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.480 (12.20mm) 0.370 (9.40mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-105-02-GF-D-500

ESQT-105-02-GF-D-500

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		2,819 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-105-02-GF-D-608

ESQT-105-02-GF-D-608

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,048 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.608 (15.44mm) 0.242 (6.15mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-104-03-G-D-310

ESQT-104-03-G-D-310

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,782 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-104-03-G-D-315

ESQT-104-03-G-D-315

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,766 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Gold - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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