RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
14-45DTS-BD-15-NTP

14-45DTS-BD-15-NTP

0.14 X 0.45 BD 15 NTP--14-45DTS-

Leader Tech Inc.
2,118 -

RFQ

14-45DTS-BD-15-NTP

Ficha técnica

Bulk - Active Fingerstock - 0.450 (11.43mm) 15.000 (381.00mm) 0.140 (3.56mm) Beryllium Copper Unplated - Adhesive
0098025102

0098025102

CSTR,STR,BF,USFT

Laird Technologies EMI
3,822 -

RFQ

Bulk Ultrasoft Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
0097054402

0097054402

GASKET BECU 6.6X406.4MM

Laird Technologies EMI
2,759 -

RFQ

0097054402

Ficha técnica

Box All-Purpose Active Fingerstock - 0.260 (6.60mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper - - Adhesive
0097060317

0097060317

CLO,STR,SNB,DLN .200X.380X.250X1

Laird Technologies EMI
2,327 -

RFQ

Bulk - Active Fingerstock - - 16.000 (406.40mm) 0.300 (7.62mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
4051PAX1R03937

4051PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .060X.50

Laird Technologies EMI
3,357 -

RFQ

4051PAX1R03937

Ficha técnica

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.500 (12.70mm) 39.370 (1.00m) 0.630 (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4219PAX1R03937

4219PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .040X.51

Laird Technologies EMI
3,804 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.510 (12.95mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097052517

0097052517

AP,STR,SNB,RA

Laird Technologies EMI
2,949 -

RFQ

0097052517

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.370 (9.40mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
4519PA51H03937

4519PA51H03937

GK,NICU,PTAFG,PU,V0,SQ .591X.591

Laird Technologies EMI
3,334 -

RFQ

Bulk 51H Active Fabric Over Foam - - 39.370 (1.00m) - Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097091002

0097091002

FINGERSTOCK BECU 15.82X381MM

Laird Technologies EMI
3,825 -

RFQ

0097091002

Ficha técnica

Box Symmetrical (S3) Slotted Active Fingerstock - 0.620 (15.75mm) 15.000 (381.00mm) 0.220 (5.59mm) Beryllium Copper - - Adhesive
4134PAX1R03937

4134PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .197X.39

Laird Technologies EMI
3,120 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.394 (10.01mm) 39.370 (1.00m) 0.197 (5.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4202AB22104800

4202AB22104800

GK,NICU,PTAF,TPE,HB,DSH .120X.25

Laird Technologies EMI
2,124 -

RFQ

Bulk 221 Active Fabric Over Foam D-Shape 0.250 (6.35mm) 4.00' (1.22m) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097054019

0097054019

AP,STR,NIB,PSA

Laird Technologies EMI
3,261 -

RFQ

0097054019

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.280 (7.11mm) 15.984 (406.00mm) 0.110 (2.79mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive
0098054117

0098054117

NOSG,STR,SNB,USF,PSA

Laird Technologies EMI
3,933 -

RFQ

Bulk Ultrasoft Foldover Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0098054119

0098054119

NOSG,STR,NIB,USF,PSA

Laird Technologies EMI
3,883 -

RFQ

Bulk Ultrasoft Foldover Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
0097052117

0097052117

NOSG,STR,SNB,PSA

Laird Technologies EMI
3,614 -

RFQ

0097052117

Ficha técnica

Bulk Foldover Active Fingerstock - 0.510 (12.95mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097052119

0097052119

NOSG,STR,NIB,PSA

Laird Technologies EMI
2,423 -

RFQ

0097052119

Ficha técnica

Bulk Foldover Active Fingerstock - 0.510 (12.95mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
7900-9035-76

7900-9035-76

DOUBLE MESH COMBO GASKET--7900-9

Leader Tech Inc.
3,272 -

RFQ

7900-9035-76

Ficha técnica

Bulk - Active Gasket Rectangle 0.500 (12.70mm) - 0.125 (3.18mm) - - - -
0C97052117

0C97052117

NOSG COIL SNB PSA

Laird Technologies EMI
3,090 -

RFQ

Bulk Foldover Active Fingerstock - 0.510 (12.95mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097052502

0097052502

.140X.370 GASKET FABRIC O/ FOAM

Laird Technologies EMI
3,633 -

RFQ

0097052502

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.370 (9.40mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper - - Adhesive
0097052702

0097052702

GASKET BECU 7.11X406.4MM

Laird Technologies EMI
2,898 -

RFQ

0097052702

Ficha técnica

Box All-Purpose Active Fingerstock - 0.280 (7.11mm) 16.000 (406.40mm) 0.055 (1.40mm) Beryllium Copper - - Adhesive
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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