RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0097055919

0097055919

TWT,STR,NIB,PSA

Laird Technologies EMI
3,275 -

RFQ

0097055919

Ficha técnica

Bulk Twist Active Fingerstock - 0.300 (7.62mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
4123PAX1R03937

4123PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .150X.35

Laird Technologies EMI
2,853 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.354 (8.99mm) 39.370 (1.00m) 0.150 (3.80mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4181PAX1R03937

4181PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .080X.39

Laird Technologies EMI
2,439 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.394 (10.01mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4208PAX1R03937

4208PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .040X.39

Laird Technologies EMI
3,635 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.395 (10.03mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0077008117

0077008117

NOSG;STR;SNB;PSA; .110X.280X.187

Laird Technologies EMI
2,860 -

RFQ

Bulk 77 Active Fingerstock - 0.787 (20.00mm) 24.000 (609.60mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097053819

0097053819

AP,STR,NIB,PSA .250X.780X.375X24

Laird Technologies EMI
3,395 -

RFQ

Bulk - Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
4080PA51G01800

4080PA51G01800

RECTANGLE

Laird Technologies EMI
2,395 -

RFQ

4080PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 1.000 (25.40mm) 18.000 (457.20mm) 0.059 (1.50mm) - - - Adhesive
4788AC22101600

4788AC22101600

GK,NICU,PTAF,TPE,HB,REC .125X.25

Laird Technologies EMI
3,791 -

RFQ

Bulk - Active - - - - - - - - -
0C98050002

0C98050002

AP COIL BF USFT PSA

Laird Technologies EMI
3,771 -

RFQ

Bulk All-Purpose Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper Unplated - Adhesive
0077007702

0077007702

GASKET BECU 4.8X241.3MM

Laird Technologies EMI
3,480 -

RFQ

0077007702

Ficha técnica

Box COMPACT PCI SYMMETRICAL Active - - 0.189 (4.80mm) 9.500 (241.30mm) - - - - -
4242PAX1R03937

4242PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .250X.25

Laird Technologies EMI
2,089 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.250 (6.35mm) 39.370 (1.00m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097060602

0097060602

FINGERSTOCK BECU 9.65X406.4MM

Laird Technologies EMI
2,004 -

RFQ

0097060602

Ficha técnica

Bulk Clip-On Active Fingerstock - 0.380 (9.65mm) 15.984 (406.00mm) 0.200 (5.08mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip
0097060302

0097060302

FINGERSTOCK BECU 9.65X406.4MM

Laird Technologies EMI
3,751 -

RFQ

0097060302

Ficha técnica

Box Clip-On Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.200 (5.08mm) Beryllium Copper - - Clip
0097060502

0097060502

FINGERSTOCK BECU 9.65X406.4MM

Laird Technologies EMI
2,745 -

RFQ

0097060502

Ficha técnica

Box Clip-On Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.270 (6.86mm) Beryllium Copper - - Clip
0098054002

0098054002

AP,STR,BF,USF,PSA

Laird Technologies EMI
2,471 -

RFQ

Bulk Ultrasoft All-Purpose Active Fingerstock - 0.280 (7.11mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper - - Adhesive
7125-12502250-71

7125-12502250-71

.125 T X 1.250 ID X 2.250 OD

Leader Tech Inc.
2,120 -

RFQ

7125-12502250-71

Ficha técnica

Bulk - Active Gasket Sleeve Round - - 0.125 (3.18mm) Steel Tin - -
81-01-14309-2000

81-01-14309-2000

FINGERSTOCK 0.22X0.6X15.75

Parker Chomerics
3,187 -

RFQ

81-01-14309-2000

Ficha técnica

Tube - Active Fingerstock - 0.561 (14.24mm) 15.748 (400.00mm) 0.220 (5.59mm) Beryllium Copper Unplated - Non-Conductive Adhesive
0098055502

0098055502

FINGERSTCK ULTRASFT 8.64X609.6MM

Laird Technologies EMI
3,577 -

RFQ

Bulk Ultrasoft Twist Active Fingerstock - 0.340 (8.64mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper - - -
4082PAX1R03937

4082PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .100X.37

Laird Technologies EMI
2,322 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.375 (9.53mm) 39.370 (1.00m) 0.100 (2.54mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0098054202

0098054202

FINGERSTCK ULTRASFT 6.35X406.4MM

Laird Technologies EMI
2,881 -

RFQ

0098054202

Ficha técnica

Bulk Ultrasoft Foldover Active Fingerstock - 0.250 (6.35mm) 16.000 (406.40mm) 0.080 (2.03mm) Beryllium Copper - - -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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